Panel Packaging Technology Enablement Director

Applied Materials

. Define and execute the panel technology enablement roadmap .

Posted 10/16/2026full-timeUnited StatesLead💰 $176,000 - $242,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Expertise in semiconductor packaging and integration, with a strong focus on advanced packaging technologies such as 2.5D/3D packaging and fine-line RDL. Proven ability to lead multidisciplinary engineering teams, manage complex technology programs, and establish strategic partnerships within the industry.

Highest-signal resume keywords

Ph.D. In Chemistry, Materials Science, Chemical Engineering, Electrical Engineering, Or PhysicsAdvanced Packaging IntegrationPanel-Format ProcessingExperience Presenting To Senior LeadershipTrack Record Of Patents And Publications

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Advanced Packaging Integration2.5D/3D PackagingHigh-Density SubstratesFine-Line RDLPVDPlatingEtchLithographyDielectric ProcessesStatistical Methods

Soft Skills

LeadershipNegotiationCommunicationMentoringTeam Building

Tools & Technologies

AI Accelerator ArchitecturesHPC Package ArchitecturesChiplet IntegrationHBM Co-Packaging

Industry Keywords

Semiconductor PackagingSubstrate Technology DevelopmentInterconnect Technology DevelopmentJoint Development AgreementsIndustry Consortia Participation

About the role

Key responsibilities & impact

Define and execute the panel technology enablement roadmap
Translate AI package architecture requirements into unit process and integration targets
Plan integrated process flows spanning core formation, through-glass via fabrication and metallization, fine-line RDL and build-up layers, and panel-scale interconnect
Lead complex integration programs from concept through customer transfer, including customized process development
Design and analyze engineering experiments using DOE and statistical methods
Establish process windows and resolve root causes on multi-process integration issues
Identify gaps in the Applied portfolio and provide feedback on process and hardware improvements
Coordinate across product divisions to deliver integrated panel solutions
Serve as primary technical lead to strategic customers on panel packaging
Position new technologies, negotiate process specifications and service offerings, and deliver customer solutions
Establish and oversee joint development programs, evaluations, and beta-site activities
Make executive-level presentations to customer and partner leadership
Build and manage strategic ecosystem partnerships
Represent Applied Materials on industry consortia, standards bodies, and technical committees
Publish and present at packaging conferences and journals
Build, lead, and develop a multidisciplinary engineering team
Set team priorities and own resource and budget planning
Recruit and retain technical talent and mentor engineers
Track program progress, communicate issues, and coordinate resources across business units
Lead patent and publication generation in panel technology

Requirements

What you’ll need

Ph.D. in chemistry, materials science, chemical engineering, electrical engineering, physics, or a related field with 12+ years of experience in semiconductor packaging, substrate, or interconnect technology development, or M.S. with 15+ years
Hands-on technical depth in advanced packaging integration, such as 2.5D/3D packaging, high-density substrates, fan-out, or build-up processing
Working knowledge of PVD, plating, etch, lithography, and dielectric processes
Demonstrated record of leading engineering teams and delivering complex technology programs to customers or into high-volume manufacturing
Experience presenting to and negotiating with senior customer and partner leadership
Track record of patents, publications, and conference presentations
Direct experience with panel-format processing, glass core substrates, through-glass vias, or fine-line RDL at sub-5 µm line/space preferred
Familiarity with AI accelerator and HPC package architectures, including chiplet integration and HBM co-packaging preferred
Established relationships across the Asia-Pacific substrate and OSAT ecosystem and participation in industry consortia preferred
Experience managing joint development agreements and multi-party technical programs preferred

Benefits

Comp & perks

Supportive work culture encouraging learning, development, and career growth
Comprehensive benefits package
Bonus program eligibility, as applicable
Stock award program eligibility, as applicable
Travel and relocation eligibility