Process Support Engineer

Applied Materials

. Guide products through their lifecycle from initial concept to final qualification .

Posted 10/26/2026full-timeCheongJu • South KoreaMid-LevelSeniorWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in semiconductor manufacturing processes, data analysis, and troubleshooting complex systems. Proficient in developing and optimizing X-ray imaging recipes while effectively communicating with customers and cross-functional teams.

Highest-signal resume keywords

Semiconductor Manufacturing ProcessesData Analysis and StatisticsX-Ray Inspection and MetrologyRoot Cause AnalysisMachine Learning for Image Data

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Data AnalysisStatistical AnalysisRoot Cause AnalysisX-Ray Inspection2D/3D Image AnalysisHypothesis ExperimentsDesign of Experiments (DOEs)Automated AnalysisAI/ML-Based Image EnhancementFailure Analysis

Soft Skills

Interpersonal SkillsCommunication Skills

Tools & Technologies

JMPPythonMATLABX-Ray CT/XRMSEM/FIBSAT/C-SAM

Industry Keywords

Memory FabHBM/Back-End PackagingInspection/MetrologyTSVMicrobump PlatingHybrid BondingUnderfill

Tech Stack

Tools & technologies

PythonRay

About the role

Key responsibilities & impact

Guide products through their lifecycle from initial concept to final qualification
Provide customer support through on-site installations, system diagnoses, service, and repair of complex systems and equipment
Work with customers and R&D teams to develop semiconductor manufacturing processes
Create hypothesis experiments and design of experiments (DOEs)
Analyze data statistically and compile reports with high-level conclusions
Troubleshoot complex problems, perform root cause analyses, and resolve process engineering and customer product issues
Drive X-ray inspection tool adoption from demonstrations through joint development and installation
Support customer qualification and issue resolution on site
Develop and optimize 2D/3D X-ray imaging recipes for HBM stacks
Detect and quantify yield-critical defects and stack metrology parameters
Apply automated analysis and AI/ML-based image enhancement
Correlate X-ray data with electrical test, failure analysis, and process data
Serve as technical liaison between the customer and global X-ray product team
Feed field requirements into the product roadmap
Support junior colleagues and lead small projects

Requirements

What you’ll need

Bachelor's degree in materials science/engineering, physics, chemistry, electrical engineering, optoelectronics, or a related field
4–7 years of experience in memory fab, HBM/back-end packaging, or semiconductor equipment industry, preferably in Inspection/Metrology or failure analysis
Hands-on experience with data analysis and statistics, e.g., JMP, Python, or MATLAB
Experience with structured problem solving and root cause analysis
Strong interpersonal and communication skills
Communication proficiency in English, written and verbal
Preferred: Master's degree or PhD in a related field
Preferred: Experience with X-ray CT/XRM, 2D X-ray inspection, or 3D image analysis
Preferred: Knowledge of HBM stacking processes, including TSV, microbump plating, MR-MUF / TC-NCF bonding, hybrid bonding, and underfill
Preferred: Experience with failure analysis methods, including cross-section, SEM/FIB, and SAT/C-SAM
Preferred: Experience applying machine learning/deep learning to image data
Preferred: Experience leading customer evaluations, demos, or joint development projects with memory customers
Preferred: Understanding of X-ray physics fundamentals

Benefits

Comp & perks

Supportive work culture encouraging learning, development, and career growth
Employee health and wellbeing programs and support
Personal and professional growth support