Senior Module Engineer, Hybrid Bonding

Applied Materials

. Develop and optimize die-to-wafer hybrid bonding processes for advanced packaging applications .

Posted 9/17/2026full-timeSanta Clara • California • United StatesSenior💰 $147,000 - $202,500 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in hybrid bonding processes, semiconductor process development, and advanced packaging technologies. Proficient in statistical process control, failure analysis, and cross-functional project leadership.

Highest-signal resume keywords

Hybrid BondingCu-Cu Interconnect FormationStatistical Process ControlDOE MethodologiesFailure Analysis

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Semiconductor Process DevelopmentSurface ChemistryPlasma ActivationDefect EngineeringMetrology TechniquesThermocompression BondingWafer BondingAdvanced PackagingChiplet IntegrationElectrical Test Structures

Soft Skills

MentoringCollaborationPresentation Skills

Tools & Technologies

JMPMinitabCSAMX-ray InspectionFIB/SEMAFMOptical Metrology

Industry Keywords

Materials ScienceElectrical EngineeringMechanical EngineeringChemical EngineeringPhysicsSemiconductor ManufacturingHBM Development3D Stacking Technologies200 mm Wafer Manufacturing300 mm Wafer Manufacturing

Tech Stack

Tools & technologies

Ray

About the role

Key responsibilities & impact

Develop and optimize die-to-wafer hybrid bonding processes for advanced packaging applications
Establish process windows for surface preparation, plasma activation, die placement, alignment and overlay control, bonding temperature and pressure, and post-bond annealing
Drive Cu-Cu and dielectric-dielectric interconnect formation for electrical performance and reliability
Support integration into memory architectures, chiplet-based systems, silicon interposers, system-on-wafer platforms, and co-packaged optics
Resolve process interactions and yield excursions with integration teams
Identify root causes of bond voids, die shift, overlay errors, non-uniform bonding, and particle contamination
Use DOE methodologies and statistical process control to improve yield and robustness
Characterize bonding quality using CSAM, X-ray inspection, FIB/SEM, AFM, optical metrology, and electrical test structures
Develop correlations between process parameters and package performance
Collaborate with equipment engineering teams on hybrid bonding systems, die placement tools, plasma activation modules, surface preparation modules, and integrated process control solutions
Evaluate and qualify next-generation bonding platforms
Define and execute reliability tests including thermal cycling, HTOL, mechanical pull/shear testing, and moisture sensitivity evaluations
Drive failure analysis and corrective actions
Lead cross-functional projects from concept through technology transfer
Publish technical results internally and externally
Present development progress to engineering leadership and customers
Mentor junior engineers and researchers

Requirements

What you’ll need

M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or Semiconductor Manufacturing, or Ph.D. in one of these disciplines
Minimum 5+ years of semiconductor process development experience after graduate degree
Direct experience in hybrid bonding, thermocompression bonding, wafer bonding, advanced packaging, HBM development, Cu interconnect technology, or chiplet integration
Strong understanding of Cu-Cu interconnect formation, surface chemistry and plasma activation, CMP and planarization, defect engineering, semiconductor process integration, and statistical process analysis
Experience with DOE and JMP/Minitab analysis tools
Familiarity with metrology and failure analysis techniques
Preferred: Ph.D. with 5+ years industry experience
Preferred experience in HBM or 3D stacking technologies, hybrid bonding equipment development, DBI, die placement systems, advanced packaging process integration, AI/HPC packaging architectures, and 200 mm/300 mm wafer manufacturing environments
Track record of patents, publications, or conference presentations preferred
Willingness to travel 10% of the time

Benefits

Comp & perks

Comprehensive benefits package
Bonus program eligibility, as applicable
Stock award program eligibility, as applicable
Relocation eligibility
Supportive work culture encouraging learning, development, and career growth
Personal and professional growth and wellbeing programs and support
10% travel