Technology Development Engineer – Hybrid Bonding, Advanced Packaging

Applied Materials

. Develop and integrate advanced packaging building blocks, including redistribution layers (RDL), damascene copper structures, wafer-level interconnects, and hybrid bonding processes .

Posted 10/5/2026internshipSingapore • SingaporeEntry LevelWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in semiconductor fabrication processes and advanced packaging integration, with a strong focus on process flow development, experimental design, and data analysis. Capable of characterizing defects and correlating process parameters with performance metrics.

Highest-signal resume keywords

Semiconductor Fabrication ProcessesAdvanced Packaging IntegrationProcess Flow DevelopmentData AnalysisDefect Characterization

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Process IntegrationExperimental DesignData AnalysisDefect CharacterizationProcess Parameter Correlation

Soft Skills

Engineering Problem-SolvingStatistical Data Analysis

Industry Keywords

Redistribution LayersDamascene Copper StructuresWafer-Level InterconnectsHybrid Bonding ProcessesChip-to-Wafer BondingWafer-to-Wafer BondingR&D ProjectsEngineering Best Practices

About the role

Key responsibilities & impact

Develop and integrate advanced packaging building blocks, including redistribution layers (RDL), damascene copper structures, wafer-level interconnects, and hybrid bonding processes
Support the Process Integration team in developing and characterizing test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding applications
Develop process flows and design experiments
Analyze data and characterize defects
Correlate process parameters with electrical and physical performance metrics
Contribute to ongoing R&D projects supporting next-generation semiconductor packaging solutions
Build understanding of advanced packaging technology, process integration principles, and engineering best practices

Requirements

What you’ll need

Internship/student position
Background or interest in semiconductor fabrication processes and advanced packaging integration
Ability to support process flow development, experimental design, data analysis, defect characterization, and correlation of process parameters to electrical and physical performance metrics
Engineering problem-solving and statistical data analysis capabilities

Benefits

Comp & perks

Supportive work culture encouraging learning, development, and career growth
Programs and support for employee health and wellbeing
Personal and professional growth support