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Technology Development Process Engineer – Hybrid Bonding, Advanced Packaging
Applied Materials. Lead development and integration of advanced packaging technologies focused on Hybrid Bonding for Logic, Memory, and 3D heterogeneous integration .
Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in Hybrid Bonding technologies and advanced packaging processes, with a strong focus on process integration, characterization methodologies, and data-driven analysis. Proven ability to collaborate with cross-functional teams and engage in technology development projects.
Highest-signal resume keywords
Hybrid BondingProcess IntegrationDesign Of Experiments (DOE)Advanced PackagingStatistical Process Analysis
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Surface PreparationPlasma ActivationDielectric-To-Dielectric BondingCu-Cu Direct BondingPost-Bond AnnealingOptical InspectionIR ImagingSEMAFMXPS
Tools & Technologies
JMPMinitab
Industry Keywords
SemiconductorTechnology DevelopmentReliabilityFailure AnalysisMetrology Techniques
About the role
Key responsibilities & impact- Lead development and integration of advanced packaging technologies focused on Hybrid Bonding for Logic, Memory, and 3D heterogeneous integration
- Develop and optimize end-to-end Hybrid Bonding processes, including surface preparation, cleaning, plasma activation, dielectric-to-dielectric bonding, Cu-Cu direct bonding, and post-bond annealing
- Design and execute process characterization and DOE studies to establish process windows and improve bonding metrics
- Investigate and resolve process integration challenges through data-driven root cause analysis
- Collaborate with equipment, materials, metrology, and integration teams on scalable die-to-wafer Hybrid Bonding solutions
- Define and implement characterization methodologies using optical inspection, IR imaging, SEM, AFM, XPS, contact angle measurement, electrical testing, and reliability evaluation
- Support HBM, Logic, TSV, RDL, and die-to-wafer bonding technology development
- Engage customers, research institutes, and ecosystem partners on joint technology development projects
- Generate technical reports, patents, publications, and technology roadmaps
- Collect and analyze data, perform hardware characterization, troubleshoot engineering issues, measure film properties, and generate technical documentation
Requirements
What you’ll need- Bachelor's, Master's, or PhD in Engineering, Materials Science, Physics, or related disciplines
- Minimum 5 years of semiconductor experience in technology development, process integration, or advanced packaging
- Hands-on experience in one or more of: Advanced Packaging, Hybrid Bonding, CMP, Plasma Processing, Wet Cleaning, TSV Integration, Process Integration
- Strong understanding of Hybrid Bonding mechanisms and package integration flows
- Experience with DOE, JMP/Minitab, and statistical process analysis
- Knowledge of reliability, failure analysis, and advanced metrology techniques
Benefits
Comp & perks- Supportive work culture encouraging learning, development, and career growth
- Programs and support for employee health and wellbeing
- Personal and professional growth support
- Relocation eligible: No