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Astrolab

Electromechanical Engineer, All-Levels

Astrolab

. Lead mechanical and structural design of space-qualified electronics enclosures for launch random vibration, acoustic loads, and shock environments .

Posted 9/25/2026full-timeHawthorne • California • United StatesJunior💰 $100,000 - $230,000 per yearWebsite

Core Competencies

Role fit
Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in mechanical and structural design of space-qualified electronics enclosures, with a strong focus on thermal management, electrical bonding, and integration of complex hardware systems. Proficient in using 3D CAD software and familiar with aerospace standards and practices.

Highest-signal resume keywords
Mechanical Design EngineeringThermal Management Concepts3D CAD Software (Siemens NX, Creo, SolidWorks)Electrical Harness DesignAerospace Systems Experience

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills
Mechanical PackagingThermal Interface MaterialsElectrical GroundingGD&TFlight Drawing PackagesBonding and Grounding VerificationRigid-Flex PCB LayoutsHeat SinksCable RoutingMass-Elastic Design
Soft Skills
CollaborationPresentation SkillsProblem-Solving
Tools & Technologies
Capital HarnessZuken E3NX Electrical Routing
Certifications & Qualifications
Bachelor’s Degree in STEMMaster’s Degree in STEM (Preferred)
Industry Keywords
Spaceflight StandardsAerospace SystemsHigh-Reliability ApplicationsVacuum EnvironmentsPDRCDRTRRMRR

About the role

Key responsibilities & impact
  • Lead mechanical and structural design of space-qualified electronics enclosures for launch random vibration, acoustic loads, and shock environments
  • Select flight-proven materials, surface treatments, and staking compounds while balancing structural stiffness, thermal conductivity, electrical bonding, and outgassing limits
  • Produce flight drawing packages with GD&T, fastener torque schedules, and electrical grounding and bonding callouts
  • Collaborate with thermal analysis teams to verify conductive thermal paths from high-power die and board interfaces to chassis conduction decks and radiator interfaces in vacuum
  • Integrate passive and active thermal control hardware, including heat pipes, thermal straps, thermal interface materials, heaters, RTDs, thermistors, and MLI blankets
  • Architect static and articulated or dynamic harness installations, including cable wrap mechanisms, service loops, twist capsules, and flex or rigid-flex jumper assemblies
  • Design custom brackets, harness support trays, strain relief features, and breakout bulkheads optimized for mass, mass-elastic constraints, and design for manufacturability
  • Present and defend mechanical packaging, harness routing schemes, and thermal hardware implementations at PDR, CDR, TRR, and MRR reviews
  • Bridge electrical, mechanical, and systems engineering disciplines and own physical, electrical, and thermal interface boundaries
  • Take hardware from conceptual trade studies through cleanroom flight builds, environmental qualification, vehicle-level integration, and flight operations

Requirements

What you’ll need
  • Bachelor’s degree in a science, technology, engineering or mathematics (STEM) related field
  • 1+ years of experience designing and developing physical hardware for high-reliability applications
  • Experience using 3D CAD software such as Siemens NX, Creo, or SolidWorks, including mechanical packaging, sheet metal, and machined enclosures
  • Experience working with electrical harnesses, interconnects, wire routing, shielding, and grounding for complex hardware systems
  • Preferred: Experience applying thermal management concepts, including heat sinks, thermal interface materials, heaters, and thermal paths for hardware operating in controlled or vacuum environments
  • Preferred: Master’s degree in a STEM-related field
  • Preferred: Experience designing or supporting flight-qualified hardware for satellites, launch vehicles, lunar landers, space robotics, or other aerospace systems
  • Preferred: Experience using 3D harness routing or electrical routing tools, such as Capital Harness, Zuken E3, or NX Electrical Routing
  • Preferred: Experience developing rigid-flex PCB physical layouts or continuous-flex interconnects
  • Preferred: Experience with spaceflight interconnect standards, including IPC/WHMA-A-620 Space Addendum and NASA-STD-8739.4
  • Preferred: Experience designing or implementing MLI for vacuum environments
  • Preferred: Experience performing bonding and grounding verification, including low-resistance or milli-ohm measurements
  • Preferred: Experience designing or supporting vehicle harness bundles or avionics enclosures used in operational aerospace systems

Benefits

Comp & perks
  • Equity ownership in the company
  • Comprehensive health benefits, including medical, dental, vision, and mental health support
  • 401(k) plan with company match
  • Flexible PTO and parental leave
  • Weekly lunch stipend
  • Complimentary snacks and beverages on-site
  • Once a month social hour on-site with food and drinks