Mechanical Engineer, RF Payloads

BLUE ORIGIN

. Lead design and packaging of mechanical structures for phased array antennas and RF payload hardware assemblies .

Posted 9/18/2026full-timeCupertino • California • United StatesMid-LevelSenior💰 $121,023 - $169,432 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in mechanical design and packaging of RF payload hardware, with a strong focus on thermal management and structural analysis. Proficient in leading engineering teams and mentoring engineers while ensuring compliance with industry standards.

Highest-signal resume keywords

Mechanical Design and PackagingThermal Management Technologies3D CAD Tools (CATIA, SolidWorks, NX)Structural and Thermal AnalysesMentoring Mechanical Engineers

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Mechanical DesignThermal AnalysisStructural AnalysisGD&T PrinciplesFinite Element SoftwareAssembly ModelingRF Hardware PackagingDesign for ManufacturabilityEngineering Drawing StandardsThermal Interface Materials

Soft Skills

Technical LeadershipCommunication SkillsMentoring

Industry Keywords

Phased Array AntennasRF Payload HardwareSpace-Qualified SystemsThermal VacuumVibration EnvironmentsASME Y14.5Contract Manufacturing

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Lead design and packaging of mechanical structures for phased array antennas and RF payload hardware assemblies
Direct thermal management strategies for high-power RF payload electronics
Perform structural and thermal analyses, including tolerance stack-ups, to validate mechanical designs
Lead architecture trade studies for RF payload mechanical packaging across programs
Serve as technical point of contact for RF payload mechanical design
Coordinate with electrical and RF engineering teams on interfaces
Provide technical leadership to suppliers and manufacturing partners
Coordinate mechanical engineering efforts across programs
Mentor junior and mid-level mechanical engineers on RF payload packaging design and analysis

Requirements

What you’ll need

Bachelor's degree in Mechanical Engineering or a related technical field
6+ years of experience in mechanical design and packaging of complex electronic hardware systems
Proficiency with 3D CAD tools such as CATIA, SolidWorks, or NX for assembly modeling
Experience performing structural and thermal analyses using analytical methods or finite element software tools
Experience applying GD&T principles and engineering drawing standards, including ASME Y14.5
Knowledge of thermal management technologies, including heat sinks and thermal interface materials, for high-power RF hardware
Experience packaging RF hardware for space-qualified systems, including radiation, thermal vacuum, and vibration environments
Experience mentoring junior and mid-level mechanical engineers
Familiarity with phased array antenna mechanical integration, including panel-level packaging and beamforming module thermal design
Experience leading design for manufacturability and testability efforts with contract manufacturers
Strong written and verbal communication skills
Must be a U.S. citizen or national, U.S. permanent resident, refugee, or asylee under export control regulations
Required to complete Blue's Standard Background Check

Benefits

Comp & perks

Medical, dental, and vision insurance
Basic and supplemental life insurance
Paid parental leave
Short- and long-term disability
401(k) with a company match of up to 5%
Education Support Program
Stock options for all regular employees working at least 20 hours/week
Up to four weeks of paid time off per year based on weekly scheduled hours
Up to 14 company-paid holidays
Potential benefits and bonuses based on role type, job level, individual contributions, and company results (not guaranteed)