Apply

Ready to go for it?

AI Apply speeds things up—apply directly if you prefer.

FREE ACCESS
5,000–10,000 jobs/day
Scoutfield Logo

See all jobs on Scoutfield

Search thousands of fresh jobs every day.

Discover
  • Fresh listings
  • Fast filters
  • No subscription required
Create a free account and start exploring right away.
Boeing

Lead Project Engineer – Microelectronic Packaging

Boeing

. Lead project coordination and management for the microelectronic packaging team developing and delivering processor packaging solutions, including 3D advanced packaging .

Posted 9/16/2026full-timePleasanton • California • United StatesSenior💰 $146,200 - $197,800 per yearWebsite

Core Competencies

Role fit
Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in project management and coordination for microelectronic packaging, with a strong focus on leading cross-functional teams and managing project risks and performance metrics. Proficient in developing technical documentation and collaborating with diverse stakeholders to achieve project objectives.

Highest-signal resume keywords
Project ManagementMicroelectronic PackagingSupplier CollaborationRisk ManagementU.S. Security Clearance

ATS Keywords

Tailor your resume
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills
Project CoordinationTrade Studies DevelopmentPerformance Metrics DefinitionTechnical ReviewsAnalytical Skills
Soft Skills
Interpersonal SkillsPresentation SkillsTeam CollaborationWritten CommunicationVerbal Communication
Tools & Technologies
MS WordMS ExcelMS PowerPoint
Certifications & Qualifications
Bachelor's Degree in EngineeringU.S. Security ClearanceSpecial Program Access
Industry Keywords
Microelectronic Packaging SolutionsProcessor PackagingCyber SolutionsARM-based System on ChipU.S. Export Control Compliance

About the role

Key responsibilities & impact
  • Lead project coordination and management for the microelectronic packaging team developing and delivering processor packaging solutions, including 3D advanced packaging
  • Collaborate with processor design, electronic circuit board design, test, field application, firmware/software, supplier management, program management, and other teams
  • Lead project execution throughout the program lifecycle, including managing the statement of work, tracking progress, and defining performance metrics
  • Coordinate packaging team trade studies and source selection processes
  • Oversee identification and management of project risks, issues, and opportunities
  • Plan, identify, and coordinate resources throughout the project or program lifecycle
  • Monitor actual results against baseline cost and schedule plans, evaluate project performance, identify efficiencies, and capture lessons learned
  • Provide leadership in project integration and execution by aligning technical and business objectives and supporting project and team plans
  • Support Boeing Defense, Space & Security's Secure Computing Solutions team developing cyber, ARM-based System on Chip solutions

Requirements

What you’ll need
  • Bachelor's degree in Engineering, Engineering Technology, Computer Science, Data Science, Mathematics, Physics, Chemistry, or non-US equivalent qualifications directly related to the work statement
  • 9 or more years' related work experience or an equivalent combination of technical education and experience
  • Ability to lead development of trade studies, supplier statements of work, supplier quality statements of work, and technical reviews
  • Ability to collaborate and work with suppliers
  • Excellent analytical, written, and verbal interpersonal skills
  • Ability to work as part of a diverse team
  • Excellent presentation skills, including adapting to executive, industry, customer, and diverse cross-disciplinary junior engineer audiences
  • Excellent MS Word, Excel, and PowerPoint skills
  • Ability to obtain a U.S. Security Clearance; U.S. Citizenship required by the U.S. Government
  • Interim/final U.S. Secret Clearance post-start required
  • Ability to obtain Special Program Access; U.S. Citizenship required
  • Must satisfy the Company's Conflict of Interest assessment process
  • Must meet U.S. export control compliance requirements as a U.S. Person
  • Employer will not sponsor applicants for employment visa status

Benefits

Comp & perks
  • Competitive base pay and variable compensation opportunities
  • Health insurance
  • Flexible spending accounts
  • Health savings accounts
  • Retirement savings plans
  • Life and disability insurance programs
  • Paid and unpaid time away from work
  • Boeing 401(k) with dollar-for-dollar matching up to 10% of eligible pay
  • Immediate 100% vesting
  • Student Loan Match for eligible enrolled U.S. employees
  • Relocation assistance is not a negotiable benefit for this position