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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in advanced packaging technologies, including 2.5D and 3D solutions, with a strong focus on cost-effective design, signal integrity, and thermal performance. Proven ability to lead cross-functional teams and manage complex projects while ensuring compliance with industry standards and customer requirements.
Highest-signal resume keywords
Ph.D. Or Master’s Degree In Mechanical, Electrical, Or Electronics Engineering10+ Years Of Relevant Experience2.5D / 3D Package DevelopmentAdvanced Multi-Layer Ceramic/Organic SubstratesThermal And Mechanical Modelling Tools
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Advanced Packaging TechnologiesSignal IntegrityThermal PerformanceFailure Analysis TechniquesCustom Flip-Chip Packaging SolutionsWafer-Level Packaging SolutionsMaterials SelectionBOM DefinitionHeterogeneous IntegrationDesign Rules
Soft Skills
Analytical SkillsProblem-Solving SkillsProject Management SkillsInterpersonal SkillsCommunication Skills
Tools & Technologies
APDAutoCADSolidWorksThermal Modelling ToolsMechanical Modelling Tools
Industry Keywords
Silicon FabricationSubstrate TechnologiesAssembly ProcessesQuality SystemsNew Product Introduction (NPI)
Tech Stack
Tools & technologiesAssemblyNode.js
About the role
Key responsibilities & impact- Collaborate with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers
- Lead development of cost-effective, high-performance advanced custom packaging solutions
- Ensure solutions meet signal integrity, thermal, structural reliability, design rule, and project schedule requirements
- Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies
- Engage current and future customers to define needs, consolidate requirements, and drive unified solutions
- Lead identification, development, and qualification of advanced packaging solutions
- Oversee program management with external assembly and memory partners
- Define technology and quality requirements
- Interface with Design Integration, Package Design, and Test Development teams
- Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps
- Drive alternate sourcing and qualification initiatives
- Help develop cutting-edge architectures for future customer and product demands
Requirements
What you’ll need- Ph.D./ Master’s degree in Mechanical, Electrical, or Electronics Engineering
- 10+ years of relevant experience
- Proven track record developing cost-effective, high-performance single- and multi-chip solutions optimized for speed, density, pin count, thermal performance, and reliability
- Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions
- Experience utilizing advanced multi-layer ceramic/organic substrates and interposers
- Experience with wafer-level packaging solutions
- 6+ years of hands-on experience in 2.5D / 3D package development and heterogeneous integration
- In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes
- Knowledge of materials selection, supplier evaluation, BOM definition, and thermal-mechanical interactions
- Comprehensive knowledge of silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems
- Hands-on experience using thermal and mechanical modelling tools
- Experience using substrate/PCB design CAD tools such as APD, AutoCAD, and SolidWorks
- Understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes
- Strong analytical, problem-solving, project management, and interpersonal skills
- Excellent communication skills for extensive collaboration with global internal/external teams and customers
- Periodic travel may be required
Benefits
Comp & perks- Discretionary annual bonus
- Competitive new hire equity grant
- Annual equity awards
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave and vacation time
- Paid Family Leave and other leaves of absence in accordance with applicable laws