Infrastructure AI/ML Engineer – Memory Design, Characterization, Yield Optimization

Broadcom

. Lead Agentic AI Infrastructure development workflows for memory design, characterization, and yield optimization .

Posted 10/14/2026full-timeUnited StatesSeniorLead💰 $150,800 - $241,200 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in Memory Design, DFT, and Silicon Yield Analysis, with a strong focus on architecting and deploying AI-driven workflows and systems. Proficient in integrating advanced technologies and methodologies to optimize performance, efficiency, and yield in high-stakes environments.

Highest-signal resume keywords

Memory DesignDFTSilicon Yield AnalysisAI Systems EngineeringEmbedded Memory Design

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Applicant Tracking System Keywords

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Hard Skills

PythonTCLSystemVerilogUVM VerificationMicroservices ArchitectureREST APIsDockerKubernetesLangGraphCompute-in-Memory Design

Tools & Technologies

EDA ToolsSynopsysCadenceSiemens EDAModel Context Protocol (MCP)Agentic Systems Integration

Certifications & Qualifications

Master’s Degree in Electrical EngineeringPh.D. in Computer Engineering

Industry Keywords

Chip Design MethodologiesIP Block Development LifecyclesVerification EnvironmentsYield ExcursionsNon-Deterministic AI Systems

Tech Stack

Tools & technologies

CloudDockerKubernetesMicroservicesPython

About the role

Key responsibilities & impact

Lead Agentic AI Infrastructure development workflows for memory design, characterization, and yield optimization
Collaborate with memory designers and DFT experts to build Agentic AI workflows for embedded memories optimized for PPA, DFT, and yield
Conceptualize, architect, deploy, and scale robust distributed multi-agent AI frameworks for memory design workflows
Orchestrate long-horizon autonomous agent executions across memory design development, silicon bring-up, and yield analysis
Integrate LLM-driven agent pipelines with EDA suites, custom in-house software tools, and enterprise data repositories
Develop and deploy ML models to automate classification of scan failures and correlate them with DFT structures
Integrate Fab process parameters, PCM data, and E-test data to predict yield excursions
Partner with Memory Design Leads, EDA Tool Specialists, and Infrastructure Engineers to create modular agentic workflows
Align AI workflow capabilities with organizational efficiency targets and technical milestones

Requirements

What you’ll need

15+ years of progressive, relevant experience in Memory design, DFT, Silicon Yield Analysis, software architecture and AI systems engineering
Master’s degree or Ph.D. in Electrical Engineering or Computer Engineering
Experience designing and characterizing embedded memory in advanced technology process nodes
Experience in compute-in-memory design and architecture
Experience architecting production-grade LLM applications, including multi-agent orchestration, function-calling/tool-use, and retrieval-augmented generation (RAG)
Experience integrating agentic systems with enterprise tools, services, and knowledge sources, including building and consuming Model Context Protocol (MCP) servers and packaging reusable agent capabilities
Deep experience with LangGraph
Fundamental grasp of chip design methodologies, IP block development lifecycles, and verification environments
Hands-on familiarity with EDA tooling and frameworks from Synopsys, Cadence, and Siemens EDA
Experience with SystemVerilog and UVM verification environments
High proficiency in Python and TCL
Expertise in microservices architecture, REST APIs, Docker, Kubernetes, Sandboxing, and config-driven workflow orchestration engine design
Proven experience establishing evaluation metrics, testing benchmarks, and safety guardrails for non-deterministic AI systems in high-stakes environments
Technical depth in Vector Databases and cloud-native containerized orchestration pipelines

Benefits

Comp & perks

Discretionary annual bonus
Competitive new hire equity grant
Annual equity awards
Medical plans
Dental plans
Vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time
Paid Family Leave and other leaves of absence in accordance with applicable laws