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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in managing complex package and PCB design projects, with a strong focus on signal and power integrity methodologies. Proven ability to collaborate with cross-functional teams and communicate effectively across multiple time zones.
Highest-signal resume keywords
Project ManagementSignal IntegrityPower IntegrityAutomation Code DevelopmentTechnical Communication
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Project PlanningSignal Integrity AnalysisPower Integrity AnalysisEDA SimulationsLab MeasurementsSystem-Level DesignPCB DesignFlip-Chip-BGA Package DesignHigh-Speed SerDesPackage Lifecycle Management
Soft Skills
Self-ManagementOrganizationClear CommunicationTeam CollaborationProductivity Maximization
Certifications & Qualifications
BSEEMSEEPhD EE
Industry Keywords
High-Performance Package DesignsAINetworkingHPC5G Base Stations
About the role
Key responsibilities & impact- Navigate and track project plans for 20+ concurrent package/PCB designs, including scope, schedules, and resources, from a technical execution standpoint
- Understand team members’ skill sets and traits to maximize productivity and retention
- Organize team and customer activities to keep projects on track
- Communicate plans, status, next steps, and risks clearly and concisely on a regular basis
- Create technical methodologies for signal and power integrity solutions
- Understand and support package and PCB technologies with input from team members
- Collaborate with customers, vendors, and cross-functional teams
- Assist engineers designing complex flip-chip-BGA packages, PCBs, and system channel links for high-speed SerDes and high-power-delivery ASICs
- Support and develop with engineering teams and contribute to technical methodologies, flows, and technical project management
- Work with worldwide R&D teams developing high-performance package designs for AI, networking, HPC, and 5G base stations
Requirements
What you’ll need- Preferred candidates have previous experience managing people and projects
- BSEE or similar field and 12+ years of work experience, or MSEE or similar field and 10+ years, or PhD EE or similar field and 7+ years
- Knowledge of package-level, PCB-level, and/or system-level signal integrity and power integrity
- Ability to cooperate with a worldwide team across multiple time zones, including co-design with internal team members and external vendor designers
- Self-management, organization, and clear communication skills
- Technical understanding of project management
- Automation code development
- SI/PI EDA extractions and simulations
- System-level SerDes channel results
- Lab measurements of passive and active systems
- Lab and measurement correlation efforts
- Lab equipment needs and management
- Package and PCB lifecycle and design flows
- Understanding of how the substrate and package fit into overall system implementation and trade-offs
- Understanding of design data creation and utilization, including package .mcm files, package spreadsheets, and POD, lid, and substrate drawings
- Must work on-site at the Broadcom office 5 days a week
Benefits
Comp & perks- Discretionary annual bonus
- Competitive new hire equity grant
- Annual equity awards
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave
- Vacation time
- Paid Family Leave and other leaves of absence according to applicable laws