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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in semiconductor package assembly processes, including NPI, process qualification, and yield improvement methodologies. Proficient in utilizing analytical techniques and quality systems to drive manufacturing excellence and support advanced packaging technologies.
Highest-signal resume keywords
Semiconductor Package Assembly ProcessesNPI and Product TransferPFMEA and Control PlansSix Sigma Green Belt or Black BeltFailure Analysis Techniques
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Flip-Chip AssemblyDie AttachWire Bond TechnologiesSMT AssemblyBGA ProcessesReflow ProfilingProcess Capability StudiesStatistical Process Control (SPC)Design of Experiments (DOE)Manufacturing Process Controls
Soft Skills
Analytical SkillsProblem-SolvingCommunicationCollaboration
Tools & Technologies
AXICT ScanCross-SectioningEDXStatistical Analysis Tools
Certifications & Qualifications
Six Sigma Green BeltSix Sigma Black BeltCertified Quality Engineer (CQE)
Industry Keywords
High-Technology ManufacturingSupplier Quality SystemsManufacturing Excellence FrameworksOptical ManufacturingPhotonics ManufacturingTelecommunications ManufacturingSemiconductor ManufacturingContract Manufacturing
Tech Stack
Tools & technologiesAssembly
About the role
Key responsibilities & impact- Lead new product introduction activities from product transfer through process qualification, validation, manufacturing readiness, and production release
- Develop, qualify, and optimize semiconductor package assembly processes, including SMT, die attach, wire bond, flip-chip, dispensing, underfill, and backend assembly operations
- Drive BGA characterization, including stencil optimization, reflow profiling, DOE, BGA rework qualification, and assembly process validation
- Establish and maintain PFMEA, Control Plans, Process Flow Diagrams, work instructions, quality plans, and manufacturing process documentation
- Define process controls, SPC monitoring requirements, process capability targets, and CTQ characteristics
- Lead root cause investigations and corrective actions using 8D, DMAIC, DOE, 5-Why, and statistical analysis tools
- Support failure analysis using AXI, CT scan, cross-sectioning, EDX, dye-and-pry, and other analytical techniques
- Drive yield improvement, defect reduction, process optimization, and continuous improvement initiatives
- Manage non-conforming materials, containment activities, MRB reviews, corrective actions, and preventive action programs
- Support supplier quality activities, manufacturing partner audits, process qualifications, and customer quality requirements
- Serve as primary technical interface for manufacturing readiness reviews, process-related issues, and customer quality escalations
- Conduct DFM/DFX reviews and identify manufacturing risks to improve quality, yield, manufacturability, and operational efficiency
- Deliver successful new product introductions and manufacturing transfers
- Establish robust, scalable, and capable manufacturing processes
- Improve manufacturing yields and reduce defect rates
- Complete manufacturing readiness, qualification, and production milestones on time
Requirements
What you’ll need- Bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Engineering, or a related discipline
- Hands-on experience supporting semiconductor package assembly processes, including flip-chip assembly, dam-and-fill, die attach, and wire bond technologies
- Strong experience with NPI, product transfer, process qualification, validation, and manufacturing readiness activities
- Experience with SMT assembly, BGA processes, reflow profiling, dispensing, underfill processes, and manufacturing process controls
- Knowledge of PFMEA, Control Plans, SPC, MSA, DOE, process capability studies, and yield improvement methodologies
- Strong analytical, problem-solving, communication, and technical documentation skills
- Ability to collaborate with engineering, manufacturing, suppliers, customers, and contract manufacturing partners
- Experience managing manufacturing quality and process-related issues in a high-technology manufacturing environment
- Six Sigma Green Belt, Black Belt, CQE, or equivalent quality certification
- Experience supporting advanced packaging technologies, including flip-chip assembly and large BGA characterization
- Experience utilizing failure analysis methods such as AXI, CT scan, cross-sectioning, EDX, and related diagnostic tools
- Experience working with EMS, ODM, or contract manufacturing partners
- Experience supporting optical, photonics, telecommunications, semiconductor, or high-reliability electronics manufacturing environments
- Knowledge of supplier quality systems, audits, qualification processes, and manufacturing excellence frameworks
- Preferred location: Vietnam
- Preferred languages: Vietnamese and English
- Chinese language capability is an additional advantage
Benefits
Comp & perks- Flexible work environment
- Employee growth opportunities
- Well-being support
- Belonging-focused culture
- Community and societal impact initiatives