Applications Engineer – SiC, Advanced Packaging

Cree

. Provide pre- and post-sales technical support to customers integrating Wolfspeed SiC substrates into 2.5D and 3D packaging architectures for HPC and AI data center applications .

Posted 9/24/2026full-timeDurham • North Carolina • United StatesMid-LevelSeniorWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in SiC substrate integration for advanced packaging architectures, with a strong focus on thermal performance analysis and customer collaboration. Proficient in guiding technical support and training for packaging engineers and ecosystem partners.

Highest-signal resume keywords

SiC Substrate IntegrationThermal Simulation ToolsAdvanced Packaging ArchitecturesTechnical SupportCommunication Skills

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Electrical EngineeringMaterials ScienceThermal Performance BenchmarkingThermal Modeling2.5D Integration3D IntegrationInterposer DesignChiplet DesignWafer ThinningMetallization

Soft Skills

Oral CommunicationWritten CommunicationPresentation Skills

Tools & Technologies

ANSYS IcepakFloTHERMCadence SigritySynopsys

Industry Keywords

HPC ApplicationsAI Data Center ApplicationsOSATsFoundriesEDA Ecosystem

About the role

Key responsibilities & impact

Provide pre- and post-sales technical support to customers integrating Wolfspeed SiC substrates into 2.5D and 3D packaging architectures for HPC and AI data center applications
Guide packaging engineers, foundries, and OSATs in selecting SiC use cases and incorporating Wolfspeed SiC wafers and substrates into advanced packaging architectures
Provide remote and on-site technical support
Identify new SiC use cases and co-design novel packaging architectures with customers, foundries, OSATs, and ecosystem players
Lead the design, development, and documentation of reference demonstrations for SiC interposer, heat-spreader, and substrate applications
Develop thermal performance benchmarks comparing SiC with silicon, glass, and ceramic
Supply validated SiC material characteristics and bond-interface data for package-level thermal modeling
Develop and present technical materials at packaging industry conferences, tradeshows, and partner workshops
Support new product and PDK launches, including training sales teams, foundry partners, and EDA ecosystem players on SiC design rules, process windows, and integration guidelines
Provide product managers with consolidated customer requirements and use-case prioritization for new SiC packaging products, interposer specifications, and PDK enhancements

Requirements

What you’ll need

Bachelor's Degree in Electrical Engineering, Materials Science, or equivalent with relevant experience
Deep industry know-how—an insider's understanding of how hyperscalers, foundries, and OSATs specify advanced packages, and the ability to translate thermal, power-density, warpage, cost, and reliability requirements into SiC material and product specifications
Understanding of advanced packaging architectures including 2.5D/3D integration, interposer structures, TSV/TSiCV fabrication, and chiplet design
Experience with thermal simulation tools (e.g., ANSYS Icepak, FloTHERM) for package-level thermal analysis; ability to model and communicate SiC's thermal advantages in high-power-density scenarios
Familiarity with packaging process flows: wafer thinning, via etching (RIE), metallization, micro-bump/hybrid bonding, and CTE mismatch considerations for SiC integration
Experience with EDA or simulation environments relevant to packaging (e.g., Cadence Sigrity, Synopsys) is a plus
Strong oral and written communication and presentation skills