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Ford Motor Company

Global Head of IVI – Audio & Connectivity Domain HW Architecture

Ford Motor Company

. Define and execute multi-year hardware technology roadmaps and commodity business plans across IVI, Audio, Display, and Connectivity.

Posted 10/16/2026full-timeDearborn • Michigan • United StatesLeadWebsite

Core Competencies

Role fit
Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in defining and executing hardware technology roadmaps and managing complex automotive electronic systems. Proven ability to lead large-scale engineering organizations while ensuring alignment with sourcing strategies and technical standards.

Highest-signal resume keywords
Hardware Technology RoadmapsHigh-Speed Digital Circuit DesignComplex Electronic Hardware CommoditiesMultidisciplinary EngineeringExecutive Communication

ATS Keywords

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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills
Electrical EngineeringComputer EngineeringSoC/Compute IntegrationRF/ConnectivityAutomotive Audio ProcessingEMC/EMI MitigationThermal ManagementDFMEARequirements ManagementValidation Plans
Soft Skills
LeadershipMentoringConsensus-BuildingProblem-SolvingDecision-Making
Tools & Technologies
EthernetCANLINZonal Compute ControllersCybersecurity Frameworks
Industry Keywords
Automotive ElectronicsConsumer ElectronicsConnected Embedded DevicesTechnical GovernanceSupply-Chain Resilience

Tech Stack

Tools & technologies
Cyber Security

About the role

Key responsibilities & impact
  • Define and execute multi-year hardware technology roadmaps and commodity business plans across IVI, Audio, Display, and Connectivity.
  • Champion platform modularity, scalability, and global hardware reuse.
  • Align technical roadmaps with sourcing strategies, supplier capabilities, capital allocations, and TVM cost-reduction targets.
  • Direct global Core and Application engineering teams and establish architectures, design rules, interfaces, and technical standards.
  • Align hardware, embedded software, vehicle electrical architectures, zonal compute controllers, RF/antennas, power systems, and cybersecurity/functional safety frameworks.
  • Lead architecture reviews, design sign-offs, technical maturity gates, and trade-off analyses.
  • Maintain end-to-end delivery accountability from concept feasibility through production launch and lifecycle support.
  • Drive requirements management, DFMEA, worst-case circuit analysis, and validation plans.
  • Establish technical readiness, launch sign-off criteria, and post-launch field stabilization metrics.
  • Partner with Manufacturing and Tier-1/Tier-2 suppliers on production readiness, tooling capacity, supply-chain resilience, and industrialization.
  • Identify root causes, mitigate technical risks, and resolve integration, launch, warranty, and field issues.
  • Lead technical escalations and resolve critical program roadblocks.
  • Lead, mentor, and inspire a global engineering organization.
  • Establish global engineering processes, technical governance, and decision-making rights.
  • Develop technical talent, succession planning, and an inclusive, high-accountability culture.

Requirements

What you’ll need
  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical discipline.
  • 15+ years of progressive engineering experience in high-complexity automotive electronic systems, consumer electronics, or connected embedded devices.
  • 8+ years leading large-scale, multi-regional engineering organizations with direct oversight of both Core and Application teams.
  • Proven track record of architecting, industrializing, and launching complex electronic hardware commodities.
  • Deep expertise in high-speed digital circuit design, SoC/compute integration, RF/connectivity, complex display modules, automotive audio processing/amplification, EMC/EMI mitigation, and thermal management.
  • Experience translating business and consumer trends into technology roadmaps, sourcing strategies, and TVM/cost optimization results.
  • Mastery of multidisciplinary engineering spanning hardware, firmware/software, Ethernet, CAN, LIN, and vehicle power distribution.
  • Exceptional executive communication and consensus-building across leadership, manufacturing operations, and global Tier-1 suppliers.
  • Capability to make enterprise-level decisions balancing cost, performance, quality, and program delivery.
  • Must be legally authorized to work in the United States.
  • Visa sponsorship is not available.

Benefits

Comp & perks
  • Generous PTO
  • Retirement, savings and stock investment plans
  • Incentive compensation
  • Immediate medical, dental, vision and prescription drug coverage
  • Flexible family care days
  • Paid parental leave
  • New parent ramp-up programs
  • Subsidized back-up child care
  • Adoption and surrogacy expense reimbursement
  • Fertility treatments
  • Vehicle discount program for employees and family members
  • Management leases
  • Tuition assistance
  • Established and active employee resource groups
  • Paid time off for individual and team community service
  • Generous schedule of paid holidays, including the week between Christmas and New Year's Day
  • Option to purchase additional vacation time
  • Professional and personal growth and recognition opportunities