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Ford Motor Company

Mechatronic Design and Release Engineer – In-Vehicle Infotainment

Ford Motor Company

. Support vehicle prototype builds, product launch, and service issues related to IVI, gateway, and connectivity electronic hardware and mechatronic integration .

Posted 10/7/2026full-timeDearborn • Michigan • United StatesMid-LevelSenior💰 $65,100 - $166,200 per yearWebsite

Core Competencies

Role fit
Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in Mechatronics Engineering with a strong focus on electronic hardware development, system integration, and compliance with automotive standards. Proficient in developing test plans and troubleshooting using advanced tools and methodologies.

Highest-signal resume keywords
MATLAB ExpertiseLTSpice ProficiencyVector Tools (CANalyzer, CANoe)Mechatronic Systems BackgroundAutomotive Design and Release Experience

ATS Keywords

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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills
Electronic Circuit DesignBoard LayoutCustom Test Scripts DevelopmentHIL Testing SetupsPower Performance AnalysisThermal ManagementPhysical PackagingData AnalysisDFMEAFMEA
Soft Skills
Excellent CommunicationLeadership SkillsCross-Functional Cooperation
Tools & Technologies
OscilloscopesMultimetersHigh-Speed Network AnalyzersThermal Imaging CamerasAutomotive EthernetCAN FDLINUSBWi-FiBluetooth
Industry Keywords
ISO/SAE 21434ISO 26262EMC RequirementsIVI ModulesMechatronic IntegrationVehicle Prototype BuildsTest PlansSystem IntegrationThermal InterfacesAntenna Placement

About the role

Key responsibilities & impact
  • Support vehicle prototype builds, product launch, and service issues related to IVI, gateway, and connectivity electronic hardware and mechatronic integration
  • Develop and execute comprehensive test plans, original test cases, and custom testing tools for bench- and vehicle-level validation
  • Perform circuit simulations, power and thermal studies, and hardware-level analysis using LTSpice and MATLAB
  • Lead power performance, thermal management, and physical packaging of IVI modules
  • Lead system integration into the vehicle, including module mounting, harness routing, thermal interfaces, and antenna placement and routing
  • Support electromechanical integration of displays and touchscreens, including mounting, optical bonding, haptic feedback hardware, and thermal behavior
  • Lead troubleshooting and problem resolution using Vector CANalyzer/CANoe and high-speed network analysis tools
  • Collect and analyze data, review system schematics, and evaluate vehicle EDS
  • Collaborate with Component, Architecture, and Systems Engineering teams on hardware/software compatibility and vehicle requirements
  • Support foundation documents including DFMEA, Design Specifications, D/PVPR, and WCCA
  • Lead technical design reviews for hardware, thermal/power, and mechanical/packaging interfaces
  • Manage Tier 1 supplier engineering activities
  • Lead cross-functional resolution of engineering issues using Fishbone and 8D strategies
  • Deliver engineering requirements for IVI and connectivity mechatronic components at development milestones
  • Develop hardware, thermal/power, packaging, and electronic control logic solutions for system feature revisions
  • Ensure designs meet ISO/SAE 21434, ISO 26262, and EMC requirements

Requirements

What you’ll need
  • BSEE (MSEE) or MS in Mechatronics Engineering preferred; other disciplines may be considered with comparable job experience
  • 5+ years of experience in automotive Design and Release (DR) or electronic hardware development
  • Expertise in MATLAB, LTSpice, and Mathcad
  • Advanced proficiency with Vector tools (CANalyzer, CANoe)
  • Proficiency with oscilloscopes, multimeters, high-speed network/protocol analyzers, and thermal imaging cameras
  • Strong background in mechatronic systems, including display/touchscreen hardware, haptics, thermal management, and high-speed connector and antenna integration
  • Experience with power performance, thermal management, and physical packaging of high-performance electronic modules
  • Experience developing custom test scripts or hardware-in-the-loop (HIL) testing setups
  • Strong analytical skills, including 8D, 6-Panel, and FMEA
  • Experience with electronic circuit design and board layout
  • Familiarity with Automotive Ethernet (100BASE-T1 / 1000BASE-T1), TSN, CAN FD, LIN, LVDS, MIPI, GMSL, FPD-Link, USB, Wi-Fi, Bluetooth, cellular 4G/5G, GNSS, and V2X
  • Excellent communication and leadership skills for cross-functional cooperation
  • Must be legally authorized to work in the United States
  • Visa sponsorship is not available

Benefits

Comp & perks
  • Immediate medical, dental, vision and prescription drug coverage
  • Flexible family care days
  • Paid parental leave
  • New parent ramp-up programs
  • Subsidized back-up child care
  • Adoption and surrogacy expense reimbursement
  • Fertility treatments
  • Vehicle discount program for employees and family members
  • Management leases
  • Tuition assistance
  • Established and active employee resource groups
  • Paid time off for individual and team community service
  • Generous schedule of paid holidays, including the week between Christmas and New Year’s Day
  • Paid time off
  • Option to purchase additional vacation time