Lead Mechanical Design Engineer

Honeywell Aerospace Technologies

. Perform independent design and layout tasks for moderate to highly complex integrated RF/high-speed layouts .

Posted 10/2/2026full-timeSan Diego • California • United StatesSenior💰 $143,000 - $180,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in RF and high-speed layout design, with strong capabilities in PCB manufacturing processes and compliance with industry standards. Proficient in using advanced CAD tools for circuit layout and mechanical design, while effectively collaborating within cross-functional teams.

Highest-signal resume keywords

High Frequency Product DesignPCB Layout OptimizationXpedition, Altium, PADS ProficiencyGD&T ExpertiseIPC 2220 Standards Knowledge

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Circuit Layout DesignMechanical Design ProcessDimensioning and TolerancingDesign Validation and TestingDFM Principles

Soft Skills

Effective CommunicationTeam CollaborationAdaptability to Changing Priorities

Tools & Technologies

XpeditionAltium DesignerPADSAutoCADSiemens NXSolidWorksSAP ERPAgile PLMTeamcenter PLM

Certifications & Qualifications

IPC CID+

Industry Keywords

Electronics PackagingMixed Mode PCB DesignMicrowave Electronics PackagingASME Y 14.5IPC 2220

Tech Stack

Tools & technologies

AssemblyERPOracle

About the role

Key responsibilities & impact

Perform independent design and layout tasks for moderate to highly complex integrated RF/high-speed layouts
Generate and revise detailed fabrication and assembly drawings from layouts and engineering change orders
Apply company design guidelines and industry standards using computer-aided design tools
Contribute to design modifications improving CCA quality and facilitating PCB manufacturing operations
Lead and oversee the mechanical design process for innovative, efficient mechanical solutions
Generate circuit layouts and drawings from schematics, block diagrams and flow charts
Incorporate engineering change orders using Xpedition, Altium, PADS, AutoCAD, Siemens NX and SolidWorks
Recommend component hardware, PCB material, tooling and metal material selections
Prepare parts lists and enter parts list data into Agile and Teamcenter PLM systems
Interface with Engineering to define mechanical assembly approaches for manufacturing and production
Support basic calculations for line impedance, temperature rise and voltage drop in RF and DC circuits
Comply with company safety policies and practices
Participate in Lean/Six Sigma activities and cross-functional problem-solving events
Collaborate in team meetings and activities
Recruit talent, identify and develop successors, drive retention and engagement, and foster an inclusive culture
Report to the Senior Manager of Design Engineering

Requirements

What you’ll need

Bachelor’s degree from an accredited institution in a technical discipline such as the sciences, technology, engineering or mathematics
Eight (8) or more years of related experience designing high frequency products that utilize multilayer mixed mode SMT along with chip and wire (MIC) design approaches
Degree in Electrical/electronics Engineering or equivalent experience in schematic creation and electro-mechanical layout design
Associate Degree in Design Drafting with direct related experience acceptable with proven design history
Strong knowledge of electronics packaging
Understanding of metal fabrication, electronics assembly and electronics manufacturing flow
Comprehensive knowledge of ASME Y 14.5 and related drawing specifications
Comprehensive knowledge of ASME Y 14.100 and related drawing specifications
Expertise in dimensioning and tolerancing
Strong working knowledge of GD&T (Geometric Dimensioning and Tolerancing)
Comprehensive knowledge of IPC 2220 series standards associated with CCA and PCB design
Ability to review and compare engineering inputs and drawings to identify inconsistencies and determine when corrections are needed
Ability to work effectively as part of an integrated design team
Ability to adapt to changing priorities and work assignments
Ability to present information and speak effectively
Ability to communicate across organizational levels
Ability to use Xpedition, Altium and/or PADS
Ability to use MS Office and enterprise information systems such as SAP, Teamcenter or Agile
Ability to perform design validation and testing
Ability to optimize PCB layouts for performance, reliability and manufacturability
Up-to-date knowledge of industry standards and technology trends
Ability to conduct design reviews and present designs to internal review members
Understanding of manufacturing processes and DFM principles
Ability to translate 2D/3D data into circuit elements for library creation and mechanical integration
Ability to generate full CAM and fabrication documentation
U.S. person status required: U.S. citizen, U.S. permanent resident, or protected status under asylum or refugee status
IPC CID+ is a plus
Knowledge of MIC design, packaging and processes is a plus
Experience in microwave or millimeter wave electronics packaging design
Experience with mixed mode, multilayer PCB design
SAP ERP and Oracle Agile PLM experience
Knowledge of Siemens ECAD/MCAD tools, Xpedition Flow, NX modeling, Valor NPI, Altium Designer, Pads Standard Plus layout and Logic
2D AutoCAD and 3D modeling software such as SolidWorks, Creo or NX

Benefits

Comp & perks

Employer-subsidized medical, dental, vision and life insurance
Short-term and long-term disability coverage
401(k) match
Flexible spending accounts
Health savings accounts
Employee assistance program
Educational assistance
Parental leave
12 paid holidays
Paid time off for vacation, personal and sick time
Performance-driven salary
Hybrid work schedule