Lead Mechanical Design Engineer

Honeywell Aerospace Technologies

. Perform independent design and layout tasks for moderate to highly complex integrated RF/high-speed layouts .

Posted 10/2/2026full-timeSan Diego • California • United StatesSenior💰 $143,000 - $180,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in high-frequency product design, including multilayer mixed-mode SMT and MIC design approaches, while applying industry standards and design guidelines using advanced ECAD tools. Proficient in generating detailed fabrication documentation and optimizing PCB layouts for performance and manufacturability.

Highest-signal resume keywords

XpeditionAltiumPADSIPC 2220 StandardsGD&T Expertise

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

High-Frequency Product DesignSchematic CreationElectro-Mechanical Layout DesignDimensioning and TolerancingDesign Validation and TestingPCB Layout OptimizationCAM Documentation GenerationEngineering Change Order ManagementElectronics Packaging KnowledgeManufacturing Process Understanding

Soft Skills

Team CollaborationProblem SolvingTalent DevelopmentEffective CommunicationCross-Functional Engagement

Tools & Technologies

SAP ERPTeamcenterAgile PLMSiemens ECAD/MCADXpedition FlowNXValor NPIAutoCADSolidWorksCreo

Certifications & Qualifications

IPC CID+Formalized ECAD Software Training

Industry Keywords

ASME Y14.5ASME Y14.100IPC StandardsLean Six SigmaElectronics Manufacturing Flow

Tech Stack

Tools & technologies

AssemblyERPOracle

About the role

Key responsibilities & impact

Perform independent design and layout tasks for moderate to highly complex integrated RF/high-speed layouts
Generate and revise detailed fabrication and assembly drawings from layouts and engineering change orders
Apply company design guidelines and industry standards using Xpedition, Altium and PADS
Contribute to design modifications that improve CCA quality or facilitate PCB manufacturing operations
Generate circuit layouts and drawings from schematics, block diagrams and flow charts
Incorporate engineering change orders using ECAD and MCAD tools
Recommend component hardware, PCB material, tooling and metal material selections
Prepare parts lists and enter parts-list data into Agile and Teamcenter PLM systems
Interface with Engineering to define mechanical assembly approaches for manufacturing and production
Support engineering calculations for line impedance, temperature rise and voltage drop in RF and DC circuits
Participate in Lean/Six Sigma activities and cross-functional problem solving
Collaborate in team meetings and activities
Recruit talent, develop successors, drive retention and engagement, and foster an inclusive culture
Report directly to the Senior Manager of Design Engineering

Requirements

What you’ll need

Bachelor’s degree from an accredited institution in a technical discipline such as the sciences, technology, engineering or mathematics
Eight (8) or more years of related experience designing high frequency products that utilize multilayer mixed mode SMT along with chip and wire (MIC) design approaches
Degree in Electrical/electronics Engineering or equivalent experience in schematic creation and electro-mechanical layout design; Associate Degree in Design Drafting with direct related experience acceptable with proven design history
Strong knowledge of electronics packaging
Understanding of metal fabrication, electronics assembly and electronics manufacturing flow
Comprehensive knowledge of ASME Y14.5 and related drawing specifications
Comprehensive knowledge of ASME Y14.100 and related drawing specifications
Expertise in dimensioning and tolerancing and strong working knowledge of GD&T
Comprehensive knowledge of IPC 2220 series standards associated with CCA and PCB design
Ability to review and compare engineering inputs and drawings to identify inconsistencies and determine corrections
Ability to work effectively as part of an integrated design team
Ability to use computer-aided design software suites including Xpedition, Altium and/or PADS
Ability to use MS Office and enterprise information systems such as SAP, Teamcenter or Agile
Ability to perform design validation and testing to ensure circuit functionality
Ability to optimize PCB layouts for performance, reliability and manufacturability
Up-to-date knowledge of industry standards and technology trends
Ability to conduct design reviews and present designs to internal review members
Understanding of manufacturing processes and design for manufacturability principles
Ability to translate 2D/3D data into circuit elements for library creation and mechanical integration
Ability to generate full CAM and fabrication documentation
U.S. person status required: U.S. citizen, U.S. permanent resident, or protected status under asylum or refugee status
IPC CID+ and formalized ECAD software training are valued
Experience in MIC, microwave or millimeter-wave electronics packaging is valued
Experience with mixed-mode, multilayer PCB design is valued
SAP ERP, Oracle Agile PLM, Teamcenter, Siemens ECAD/MCAD, Xpedition Flow, NX, Valor NPI, Altium Designer, PADS, AutoCAD, SolidWorks, Creo experience is valued

Benefits

Comp & perks

Employer-subsidized medical, dental, vision and life insurance
Short-term and long-term disability coverage
401(k) match
Flexible spending accounts
Health savings accounts
Employee assistance program
Educational assistance
Parental leave
12 paid holidays
Paid time off for vacation, personal and sick time
No relocation package