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Senior Hardware Engineer – Circuit Design
Hyundai Mobis North America. Design and develop automotive electronic control modules, PCB/circuit systems, and components for HUD, ICS, displays, and related products .
About the role
Key responsibilities & impact- Design and develop automotive electronic control modules, PCB/circuit systems, and components for HUD, ICS, displays, and related products
- Perform field failure analysis, root cause analysis, and solution evaluation for production and electrical issues
- Manage project schedules and milestones
- Analyze OEM and internal requirements and translate them into hardware designs
- Support OEM development-stage events, vehicle-level validation, and automotive subsystem development
- Act as liaison between MOBIS HQ, OEMs, local teams, R&D, suppliers, and customers from concept through final design
- Coordinate design reviews, changes, feasibility reviews, and hardware engineering data/document delivery
- Work onsite at MNA and frequently offsite at OEM facilities
- Collaborate with research engineers from Korea and/or in Korea, including remote or business-site coordination
- Perform prolonged desk and computer work in an office environment
Requirements
What you’ll need- Engineering Degree, B.S. in Electrical Engineering or equivalent preferred
- Approximately 5+ years of experience in electronic product design or automotive industry, focused on PCB and circuit design
- Understanding of electronic control module and component design and manufacturing
- Experience with vehicle electrical connectors, housings, and insulators
- Understanding of I2C, SPI, CAN, RS232, USB, and Ethernet protocols
- Experience with field failure analysis and solution evaluation for production product issues
- Experience with CAD interfaces, including Zuken, Mentor Graphic, or others
- PCB/circuit design experience, including digital/analog, video input/output, power, communication, and LVDS
- Working knowledge of Deserializer, Micro application, CAN transceiver, PMIC/Buck Converter, CPU, and LED driver components
- Ability to manage schedules and milestones
- Ability to analyze requirements and specifications and translate them into hardware designs
- Ability to perform root cause analysis at sample, bench, and vehicle level
- Ability to support OEM development stage events and automotive subsystem development
- Hands-on experience with Oscilloscope and Spectrum analyzer
- Ability to read schematics, block diagrams, and system requirements
- Previous automotive engineering experience at a Tier 1 Supplier
- Design-level Hardware Engineering experience with Major OEMs
- Ability to travel to manufacturing locations in the USA and global locations
- Must be able to lift 15 pounds at times
- Must be able to access and navigate each department at the organization's facilities
- Mobis does not provide immigration-related sponsorship; applicants must not require Mobis sponsorship now or in the future, including H-1B, OPT, STEM OPT, CPT, TN, and J-1
Benefits
Comp & perks- Flexible working hours
- Hybrid work schedule with 3 days on site required
- Equal opportunity employment
- Reasonable accommodation for applicants with disabilities