Process Integration & Program Leader – Hybrid Bonding, 3DIC

Intel Corporation

. Own the process integration strategy and execution for advanced hybrid bonding and 3DIC technologies .

Posted 11/12/2026full-timeHillsboro • Oregon • United StatesSenior💰 $248,400 - $350,690 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates extensive experience in semiconductor technology development, particularly in process integration and manufacturing, with a strong focus on driving cross-functional collaboration and optimizing performance metrics. Proven ability to lead complex technical programs and engage with stakeholders to translate requirements into actionable strategies.

Highest-signal resume keywords

Process IntegrationYield ImprovementManufacturing Problem SolvingCross-Functional LeadershipHybrid Bonding

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Semiconductor Technology DevelopmentProcess IntegrationManufacturing RampDefect ReductionQuality AssuranceReliability EngineeringHeterogeneous IntegrationWafer-Level PackagingAdvanced InterconnectTechnical Judgment

Soft Skills

Influencing StakeholdersCommunication SkillsProblem Solving

Industry Keywords

3DICAdvanced Semiconductor TechnologiesTechnical PrioritiesCross-Module OptimizationTechnology Transfer

About the role

Key responsibilities & impact

Own the process integration strategy and execution for advanced hybrid bonding and 3DIC technologies
Drive cross-module optimization across performance, yield, defectivity, reliability, quality, cost, and manufacturability
Lead resolution of complex process integration and manufacturing challenges
Drive technology maturity from development through qualification, technology transfer, manufacturing ramp, and high-volume manufacturing
Lead integrated execution across Process Development, Module Engineering, Yield, Manufacturing, Quality, Product Engineering, Supply Chain, and business organizations
Establish technical priorities, evaluate tradeoffs, manage risks, and drive cross-functional decisions
Partner with customers and product teams to translate requirements into technology and execution priorities
Communicate technology readiness, risks, and recommendations to senior leadership and customer stakeholders
Drive technical learning and best-known methods across development and manufacturing organizations

Requirements

What you’ll need

Significant semiconductor technology-development experience spanning process integration and manufacturing
Experience leading complex technologies from development through qualification and manufacturing ramp
Strong expertise in process integration, yield improvement, defect reduction, quality, reliability, and manufacturing problem solving
Demonstrated ability to lead large, cross-functional technical programs and drive decisions across organizational boundaries
Experience engaging directly with customers on technical requirements, risks, commitments, and escalations
Degree in Engineering, Materials Science, Physics, or related technical field
BS with 12+ years of relevant experience; MS with 8+ years; or PhD with 6+ years
Position of Trust: must consent to and pass an extended Background Investigation, including extended education, SEC sanctions, and additional criminal and civil checks (subject to country law)
Preferred: experience with hybrid bonding, 3DIC, heterogeneous integration, wafer-level packaging, advanced interconnect, or leading-edge semiconductor process technologies
Preferred: experience taking advanced semiconductor technologies into high-volume manufacturing
Preferred: strong technical judgment and track record of solving difficult integration, yield, and manufacturing problems
Preferred: ability to influence senior technical leaders, customers, and cross-functional stakeholders in a fast-moving development environment

Benefits

Comp & perks

Stock bonuses
Health benefits
Retirement benefits
Vacation benefits
Hybrid work model allowing employees to split time between on-site and off-site work