Assembly Process Engineer

Microchip Technology Inc.

. Develop, set up, optimize, and sustain Flip Chip BGA assembly processes .

Posted 11/9/2026full-timeThailandJuniorMid-LevelWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in Flip Chip BGA assembly processes, focusing on Heat Spreader Attachment and Ball Attachment, while ensuring high-quality manufacturing through effective process evaluation and optimization. Proficient in utilizing methodologies such as DOE, SPC, and PFMEA to enhance yield and reduce defects.

Highest-signal resume keywords

Flip Chip BGA Assembly ProcessesSemiconductor Assembly Process EngineeringDOE, SPC, PFMEA, 8DTroubleshooting and Analytical SkillsCross-Functional Collaboration

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Process EvaluationYield ImprovementDefect ReductionMachine SetupProcess SetupEngineering Drawings InterpretationTechnical DocumentationAssembly Process OptimizationHeat Spreader AttachmentBall Attachment

Soft Skills

Strong CommunicationCross-Functional Collaboration

Tools & Technologies

Dispensing EquipmentPlacement EquipmentReflow EquipmentBall Mounting EquipmentInspection Systems

Industry Keywords

Semiconductor Assembly MaterialsProcess InteractionsHigh-Volume ManufacturingRoot Cause Analysis

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Develop, set up, optimize, and sustain Flip Chip BGA assembly processes
Focus on Heat Spreader Attachment and Ball Attachment processes
Perform machine setup and process setup
Evaluate processes and improve yield
Reduce defects
Support high-volume manufacturing operations
Work closely with production, quality, equipment, and product engineering teams
Ensure stable and reliable assembly performance

Requirements

What you’ll need

Bachelor’s Degree in any Engineering related field
Minimum 2–5 years of semiconductor assembly process engineering experience
Experience in Flip Chip BGA package assembly processes
Knowledge of semiconductor assembly materials and process interactions
Experience with DOE, SPC, PFMEA, 8D, and root cause analysis methodologies
Ability to interpret engineering drawings, process specifications, and technical documentation
Familiarity with assembly equipment used in dispensing, placement, reflow, ball mounting, and inspection systems
Good troubleshooting and analytical skills
Strong communication and cross-functional collaboration skills
Willingness to travel 0%–25%

Benefits

Comp & perks

Leadership Passage Programs supporting career growth
Employee development opportunities
Strong sense of community
Company perks
Values-based decision making and supportive workplace culture