Test Engineer

Mission Technologies, a division of HII

. Lead prototype hardware builds, reliability testing, and failure analysis for the U.S.

Posted 10/5/2026full-timeAdelphi • Maryland • United StatesJuniorMid-Level💰 $79,869 - $180,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in electronics packaging, reliability testing, and failure analysis, with proficiency in SolidWorks and ANSYS Workbench for mechanical design and modeling. Capable of leading laboratory test campaigns and integrating electronics into complex systems while ensuring compliance with industry standards.

Highest-signal resume keywords

Electronics PackagingSoldering SMT and Through-HoleSolidWorks Mechanical DesignANSYS Workbench FEA ModelingTest Plan Development

ATS Keywords

Tailor your resume

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills

Failure AnalysisThermal and Mechanical Stress ModelingMixed-Signal PCB AssemblyFrequency-Domain Signal AnalysisDestructive and Non-Destructive TestingDFM Guidelines DevelopmentMicroscope-Level AssemblyEnvironmental TestingRoot Cause AnalysisCalibration Management

Soft Skills

Mentoring Junior PersonnelCollaboration with Cross-Functional Teams

Tools & Technologies

DMMsOscilloscopesSpectrum AnalyzersTemperature ChambersProbe StationsExcel/O365CNC Machining3D PrintingX-Ray InspectionScanning Acoustic Microscopy

Certifications & Qualifications

IPC J-STD-001IPC-A-610SECRET Security Clearance

Industry Keywords

PCB AssembliesElectromechanical IntegrationThermal CyclingVibration TestingDielectric Strength TestingFailure ModesCleanroom ToolsField-Test ExperienceMetrologyWafer-Level Processes

Tech Stack

Tools & technologies

AssemblyRay

About the role

Key responsibilities & impact

Lead prototype hardware builds, reliability testing, and failure analysis for the U.S. Army Research Laboratory
Package and protect die-level and PCB assemblies using polymerics and metals
Model thermal, electrical, mechanical, and vibration stresses and failure modes
Execute laboratory and field test campaigns, including THB, temperature cycling, vibration, dielectric strength, and partial discharge testing
Perform destructive and non-destructive analysis to drive design improvements
Assemble and solder complex mixed-signal analog, digital, and RF boards
Integrate electronics into electromechanical housings, ensuring fit, thermal paths, strain relief, shielding, sealing, and serviceability
Select and qualify adhesives, underfills, potting compounds, coatings, solder, and sintered metallurgical systems
Define process recipes and create work instructions
Create SolidWorks mechanical designs and engineering drawings with GD&T
Conduct FEA/multiphysics modeling in ANSYS Workbench or COMSOL
Develop DFM guidelines and release designs for CNC machining, sheet metal, injection molding, and 3D printing
Coordinate with machine shops/vendors and review NCR and FAI results
Build and iterate test fixtures and jigs
Set up and operate probe stations, heated stages, THB chambers, and temperature cycling equipment
Perform FFT and spectrum analysis of mixed-signal/RF chains
Develop test plans, procedures, and acceptance criteria; capture traceable datasets
Conduct cross-sectioning, grinding, polishing, optical inspection, X-ray, and scanning acoustic microscopy
Drive root cause analysis and corrective actions; maintain failure-analysis reports and lessons learned
Author assembly procedures, test protocols, drawings, BOMs, RCA/FA reports, and engineering memos
Manage lab inventories, calibration schedules, and component stock using Excel/O365
Ensure ESD, safety, and quality compliance
Collaborate with electrical, mechanical, materials, computer science, and research staff
Mentor junior personnel

Requirements

What you’ll need

2–9 years relevant experience with a bachelor’s degree in a related field; or 0–7 years with a master’s degree; or 0–4 years with a PhD or Juris Doctorate; or high school diploma/equivalent and 6–13 years relevant experience
Role-specific experience requirements vary by level: Test Engineer 2, 3, or 4
Proficiency in electronics packaging and test
Soldering SMT and through-hole, cable/harness assembly, and PCB rework under a microscope
Ability to read/create schematics, assembly drawings, BOMs, and work instructions
Experience operating DMMs, oscilloscopes, spectrum/network analyzers, power supplies, temperature chambers, and probe stations
Frequency-domain signal analysis for diagnostics and performance verification
Hands-on mechanical aptitude integrating electronics into housings and fixtures
Strong Microsoft Office 365 proficiency, including Excel, Word, PowerPoint, SharePoint, and OneDrive
Ability to obtain and maintain a SECRET security clearance
Preferred: IPC J-STD-001 and IPC-A-610 standards
Preferred: adhesives, underfills, encapsulants, solder alloys, sintered joints, wire bonding, flip-chip underfill, high-voltage insulation, SiC/GaN power modules, SolidWorks, ANSYS Workbench, COMSOL, PCB CAD, DFM, metrology, environmental testing, X-ray, C-SAM, microscopy, wafer-level processes, cleanroom tools, and field-test experience
Ability to work in office, industrial, and laboratory environments, including ladders, confined spaces, and temperature variances
Fine motor skills for microscope-level assembly
Ability to lift lab equipment/fixtures and stand at benches for extended periods

Benefits

Comp & perks

0–10% required travel
Opportunity to lead technical activities
Mentorship opportunities
Work on impactful, emerging technologies
Reasonable accommodations for the employment process