Package Layout Engineer – Hardware

NVIDIA

. Collaborate with the Technical Package Lead and different design teams in designing and developing detailed IC substrate layouts for NVIDIA products .

Posted 10/13/2026full-timeUnited StatesJuniorMid-Level💰 $108,000 - $184,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in IC substrate layout design, including high-speed and density ASIC packages, while effectively collaborating with design teams to optimize performance and cost. Proficient in using Cadence APD and other PCB layout tools to enhance productivity and ensure design integrity.

Highest-signal resume keywords

IC Substrate Layout DesignCadence APDHigh-Speed Design Signal IntegrityPCB Layout ToolsDesign Feasibility Studies

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

PCB LayoutSubstrate LayoutHDI DesignsWire Bond PackagesFlip Chip PackagesPackage RoutingPower DistributionLayout ProductivityConstraint ManagerDesign Methodologies

Soft Skills

CollaborationProblem SolvingCommunication

Tools & Technologies

Cadence APDSiP ToolsValorVirtuosoCalibre

Certifications & Qualifications

B.S. Electrical Engineering

Industry Keywords

Graphics CardsMotherboardsLine CardsASIC PackagesDesign Trade-Offs

About the role

Key responsibilities & impact

Collaborate with the Technical Package Lead and different design teams in designing and developing detailed IC substrate layouts for NVIDIA products
Work with design teams to plan schedules and resolve cost, manufacturing, and electrical design issues
Collaborate within a Layout team to implement high-speed/density ASIC packages
Perform substrate breakout patterns for ASIC packages
Optimize package pinout using system-level trade-offs for pin assignment
Perform package routing, placement, stack-up, reference plane, and power distribution using Cadence APD or SiP tools
Propose layout design trade-offs to the Technical Package Lead
Conduct design feasibility studies for package size, cost, and system performance
Develop symbols and CAD library databases using Cadence APD design tools
Develop methodologies to improve layout productivity

Requirements

What you’ll need

Hold a B.S. Electrical Engineering or equivalent experience
2+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
Experience with HDI designs is a plus
Proven experience in substrate layout of wire bond and flip chip packages is preferred
Significant background with Cadence APD or SiP and/or PCB layout tools, including Constraint Manager
Solid understanding of high-speed design signal integrity practices
Experience with Virtuoso and Calibre is a plus
Experience using Valor is helpful

Benefits

Comp & perks

Equity
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