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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in package technology development and system integration, with a strong focus on yield mechanics, manufacturability, and co-design approaches. Proven ability to analyze and improve assembly processes while collaborating across multiple teams and interfaces.
Highest-signal resume keywords
Package Technology DevelopmentYield Mechanics AnalysisDesign-For-ManufacturabilityCo-Packaged Optics ExperienceElectrical Engineering Degree
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
2.5D IntegrationChiplet IntegrationOrganic Substrate IntegrationAssembly Yield MechanicsTest Strategy DevelopmentThermal Maturity ImprovementModule Yield AnalysisDesign Guidance ConversionManufacturability ApproachesComplex Activity Management
Soft Skills
Analytic CapabilitiesTechnical LeadershipCross-Organizational Collaboration
Tools & Technologies
Assembly Floor ExperienceFoundry ExperienceOSAT ExperiencePhotonics TechnologiesFiber Attach TechniquesLaser Attach Techniques
Industry Keywords
High-End ASICsMulti-Die ModulesAssembly IntegrationFailure Modes IdentificationTolerance Relaxation
Tech Stack
Tools & technologiesAssembly
About the role
Key responsibilities & impact- Lead the technical assessment of package risk across chip programs, identifying failure modes in substrate, interposer and assembly integration before silicon
- Quantify package risk cost and schedule impact and present risks in program and technology reviews
- Drive manufacturability approaches across package, substrate, interposer and silicon
- Improve yield, capacity and supply review, test strategy, thermal maturity and assembly process maturity
- Push co-design approaches including tolerance relaxation by design, testability before attach, design margins, redundancy and partial-module recovery
- Analyze module yield mechanics and reconcile predicted versus actual yield on units returning from assembly
- Convert yield findings into concrete design guidance
- Evaluate emerging packaging and photonics technologies, including outside partner solutions
- Define product requirements with the advanced technology group
Requirements
What you’ll need- B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent experience
- More than 15 years of experience in package technology development or system integration, with multiple products carried through assembly
- Deep understanding of 2.5D, chiplet and organic substrate integration
- Working knowledge of assembly and module yield mechanics, including how alignment tolerance and process excursions drive assembly yield differently from defect density at the die level
- Strong analytic capabilities
- Ability to drive complex activities involving many interfaces and teams, and to hold a technical position across organizations
- Hands-on experience on an assembly floor, a foundry or at an OSAT
- Experience with co-packaged optics, photonic packaging, or fiber and laser attach
- Proven experience driving design-for-manufacturability into early architecture decisions
- Familiarity with working on large high-end ASICs and multi-die modules
Benefits
Comp & perks- Highly competitive salaries
- Comprehensive benefits package