Field Applications Engineer Intern – Summer 2027

NXP Semiconductors

. Work alongside experienced FAEs on customer-facing technical projects .

Posted 10/6/2026internshipUnited StatesEntry LevelWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates strong capabilities in embedded systems development, including firmware and application coding in C, C++, and Python. Proficient in technical customer engagement, product evaluation, and system integration across various hardware and software platforms.

Highest-signal resume keywords

Embedded Systems DevelopmentFirmware Development in C/C++/PythonTechnical Customer SupportSchematic and PCB ReviewMicrocontroller and MPU Experience

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Firmware DevelopmentApplication CodingEmbedded SystemsMicrocontrollersMPUsFPGAsReal-Time Operating SystemsDebuggingSystem IntegrationLab Validation

Soft Skills

Technical CommunicationCollaborationProblem SolvingPresentation SkillsCustomer Engagement

Tools & Technologies

Development BoardsEvaluation KitsSDKsIDELab EquipmentSchematic Review ToolsDebugging ToolsVersion Control SystemsEmbedded LinuxSensor Integration

Industry Keywords

Analog CircuitsDigital CircuitsMicrocontrollersWireless CommunicationsPower ElectronicsControl SystemsSemiconductor ApplicationsUARTSPII2C

Tech Stack

Tools & technologies

LinuxPythonRTOSC++

About the role

Key responsibilities & impact

Work alongside experienced FAEs on customer-facing technical projects
Understand customer requirements and help select appropriate NXP MCUs, MPUs, connectivity, analog, power-management, and edge-processing solutions
Support technical customer meetings, design reviews, product evaluations, proof-of-concept activities, and NXP solution demonstrations
Analyze customer issues, reproduce problems, document findings, and contribute to technical action plans and follow-up
Bring up evaluation boards and reference designs; configure SDKs and development environments; integrate example software into application prototypes
Develop or modify firmware and application code in C, C++, Python, or similar languages
Support embedded software debugging and system integration across real-time control, sensor interfaces, connectivity, Linux, or RTOS-based applications
Perform product evaluation, lab validation, and basic system-level troubleshooting using lab equipment and software debug or trace tools
Assist with schematic and PCB reviews, interface checks, power-up sequencing, signal observations, and hardware/software integration investigations
Create test plans, capture measurements, organize results, and communicate conclusions to technical and non-technical stakeholders
Prepare customer-ready technical presentations, demonstrations, quick-start guides, application notes, and training material
Capture customer feedback and collaborate with sales, marketing, product management, product-line, and engineering teams
Present summer project findings, technical approach, results, and recommendations in a final intern capstone presentation

Requirements

What you’ll need

Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field
Rising junior, senior, or graduate student
Expected graduation between December 2027 and June 2029
Cumulative GPA of 3.0/4.0 or higher
Authorization to work in the United States; no sponsorship available for intern roles
Availability for 12 weeks full-time during Summer 2027 (May–August)
Coursework or project experience in embedded systems, analog and digital circuits, computer architecture, microcontrollers/processors, wireless communications, power electronics, control systems, or semiconductor applications
Hands-on experience with microcontrollers, MPUs, FPGAs, development boards, evaluation kits, or reference designs; familiarity with ARM-based systems is a plus
Programming experience in C, C++, Python, or similar languages, with exposure to IDEs, SDKs, version control, RTOS basics, or embedded Linux
Familiarity with UART, SPI, I2C, CAN, USB, or Ethernet
Experience using or willingness to learn common lab equipment, schematic/PCB review, board bring-up, firmware debugging, sensor integration, motor control, edge AI, or robotics applications

Benefits

Comp & perks

Competitive paid hourly compensation
Dedicated FAE/TSE mentor and day-to-day manager support throughout the program
Hands-on exposure to the semiconductor applications cycle—from requirements discovery and technical evaluation through proof-of-concept and design-in support
Participation in intern cohort events, including professional development workshops, executive speaker sessions, and cross-functional networking opportunities
Access to structured learning on NXP product portfolios, embedded systems, customer applications, and the semiconductor industry
Potential relocation support or housing stipend (location-dependent)
Consideration for a return full-time offer into NXP's TSAP program upon graduation