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Head – SoC Physical Design Manager
NXP Semiconductors. Lead, develop and grow a team of Physical Design, STA and signoff engineers .
Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates extensive expertise in Physical Design strategy and execution for complex IC and mixed-signal SoC developments, with a strong focus on Static Timing Analysis, power integrity, and physical verification. Proven ability to lead and mentor engineering teams while fostering a culture of collaboration and continuous improvement.
Highest-signal resume keywords
Physical Design StrategyStatic Timing AnalysisPower IntegrityTeam LeadershipEDA Methodologies
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Place & RouteTiming ClosurePhysical SignoffIR-Drop AnalysisElectromigrationSignal IntegrityPower ManagementPhysical VerificationDRCLVS
Soft Skills
MentoringCollaborationCommunicationInfluencing DecisionsTechnical Leadership
Tools & Technologies
EDA ToolsAutomation ScriptsDesign FlowsPower PlanningClock-Tree Implementation
Industry Keywords
IC DesignSoC DevelopmentMixed-Signal IntegrationAnalog/Digital InterfacesTape-Out Readiness
About the role
Key responsibilities & impact- Lead, develop and grow a team of Physical Design, STA and signoff engineers
- Establish technical direction, priorities and accountability across the team
- Build an engineering culture based on technical excellence, collaboration, ownership and continuous improvement
- Coach and mentor engineers and technical leaders
- Identify competency and capability needs and develop the organization
- Support resource and capability planning across multiple development programs
- Own Physical Design strategy and execution for complex IC and mixed-signal SoC developments
- Lead floorplanning, partitioning, power planning, placement, clock-tree implementation, routing and physical optimization
- Drive Static Timing Analysis and timing closure in complex multi-mode, multi-corner environments
- Lead implementation and verification of power-management architectures
- Drive power integrity and reliability activities, including IR-drop and electromigration
- Provide technical leadership for mixed-signal physical integration at analog/digital interfaces and noise-sensitive circuitry
- Ensure physical verification and signoff, including DRC, LVS and tape-out readiness
- Lead technical reviews and resolve timing, congestion, power, signal-integrity, reliability and physical-verification challenges
- Collaborate with architecture and front-end teams to influence early design decisions
- Share knowledge and develop company-wide Physical Design best practices across NXP
- Standardize and improve P&R, STA, power, physical-verification and signoff flows
- Promote reuse of methodologies, automation, scripts, flows and engineering solutions
- Partner with EDA, methodology, technology, library and IP teams
- Drive adoption of improved methodologies and technologies
- Represent the organization in cross-NXP technical discussions and shape the Physical Design strategy and roadmap
Requirements
What you’ll need- Significant experience in advanced IC/SoC Physical Design, supported by multiple successful tape-outs and ramp of high volume products
- Deep technical knowledge of Place & Route, STA, timing closure, packaging, physical signoff, IR-drop, EM, signal integrity, power integrity and reliability for low power designs with complex power management
- Strong understanding of the interaction between architecture, RTL, synthesis, DFT, Physical Design, analog design, packaging and silicon validation
- Experience improving and industrializing EDA methodologies, automation and design flows
- Proven experience leading and developing engineering teams
- Demonstrated ability to mentor technical experts and develop future technical and organizational leaders
- Experience collaborating across multiple organizations, sites or business groups
- Ability to influence technical decisions beyond the direct reporting organization and build alignment between engineering teams
- Strong communication skills and ability to translate complex engineering issues into clear technical and program decisions