Package Design Electrical Engineer

NXP Semiconductors

. Provide optimized package design solutions for New Product and New Technology Introductions (NPI, NTI) .

Posted 10/8/2026full-timeUnited StatesMid-LevelSeniorWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Expertise in microelectronics packaging design and electromagnetic modeling, with proficiency in simulation tools and a strong understanding of electrical design for semiconductor applications. Ability to collaborate effectively with cross-functional teams to optimize package solutions and enhance performance metrics.

Highest-signal resume keywords

MSEE+ DegreeElectromagnetic ModelingHFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADSRadio Frequency Design ExperiencePCB Design Experience

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Microelectronics Packaging DesignElectromagnetic ModelingElectrical Design RulesIO Interface DesignSystem-Level Simulation

Soft Skills

Team PlayerPositive AttitudeSelf-DrivenExcellent Communication SkillsAdaptability

Tools & Technologies

HFSSQ3DAWRCST Microwave StudioKeysight EMProADSCadence Signal Integrity Tools

Industry Keywords

System on ChipPrinted Circuit BoardBack End of Line DesignRadio FrequencySemiconductor Industry

About the role

Key responsibilities & impact

Provide optimized package design solutions for New Product and New Technology Introductions (NPI, NTI)
Define packages that meet product requirements for electrical performance, manufacturability, and cost
Run Electromagnetic (EM) modeling tools to ensure package performance and document modeling results
Work with business line System on Chip (SoC) and Printed Circuit Board (PCB) teams to optimize package solution performance
Provide electrical design rules to the Package Design Layout (PDL) team and optimize package layout using electrical modeling data to improve IO interface and power performance
Provide package electrical data or models to Business Line (BL) teams for system-level simulation

Requirements

What you’ll need

MSEE+ with experiences in microelectronics packaging design and EM modeling or related field required
EM educational background
Proficient on EM modeling and simulation tools (HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, Cadence Signal and power integrity tools) strongly preferred
Radio Frequency (RF) design experience, RF and multiple GHz wired & wireless modeling experience, and antenna modeling experience preferred
Understand electrical design of various IO interfaces (e.g. LVDS, DDR, SerDes) used in semiconductor industry
PCB design experience or worked with PCB designer preferred
Knowledge on die level Back End of Line (BEOL) design is a plus
Team player with positive attitude, self-driven proactive mindset, and innovative outlook
Excellent written and verbal communication and presentation skills required
Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally

Benefits

Comp & perks

Equal Opportunity/Affirmative Action Employer
Reasonable accommodations for otherwise qualified disabled individuals