Senior Principal Packaging Engineer

NXP Semiconductors

. Serve as an experienced technical lead within NXP’s Package Innovation organization .

Posted 10/14/2026full-timeUnited StatesSeniorWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in semiconductor packaging development and advanced packaging technologies, with a strong focus on defining package architectures and delivering solutions for new product introductions. Proven ability to lead cross-functional technical programs and communicate effectively with diverse teams and stakeholders.

Highest-signal resume keywords

Semiconductor Packaging DevelopmentAdvanced Packaging TechnologiesCross-Functional Project LeadershipTechnical CommunicationPackage Design and Engineering

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Mechanical EngineeringMaterials ScienceChemical EngineeringElectrical EngineeringPackage TechnologyAssembly Process DevelopmentIC Package FamiliesFan-Out PackagingPanel-Level PackagingHeterogeneous Integration

Soft Skills

Clear CommunicationTeam CollaborationRisk Assessment

Industry Keywords

New Product IntroductionsPower ManagementVehicle ElectrificationHigh-Performance ComputeReliabilityManufacturabilityCost ManagementTechnology RoadmapsPrototype BuildsQualification

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Serve as an experienced technical lead within NXP’s Package Innovation organization
Define and deliver package solutions for new products and new technologies across NXP business lines
Provide standard and advanced packaging solutions supporting vehicle electrification and power management, robotics, and high-performance compute/datacenters, with focus on analog and power delivery
Define package architectures, materials, structures, and assembly process flows meeting requirements for reliability, performance, manufacturability, and cost
Drive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, internal assembly sites, OSATs, material suppliers, and external technology partners
Monitor industry trends in advanced packaging, panel-level packaging (PLP), and power packaging
Define and drive associated technology roadmaps
Ensure package deliverables for New Product Introductions (NPI) and New Technology Introductions (NTI), including feasibility assessment, package design, prototype builds, characterization, qualification, risk retirement, release, and production ramp support
Travel internationally to NXP assembly sites, OSATs, suppliers, and technology partners as needed

Requirements

What you’ll need

B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field
10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields
Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages
Experience leading cross-functional technical projects with contributors from multiple engineering, co-design, manufacturing, product, quality, supplier, and management organizations
Ability to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences
Fluent English communication skills, written and verbal
Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred

Benefits

Comp & perks

Equal Opportunity/Affirmative Action employment policy
Reasonable accommodations for otherwise qualified disabled individuals
International travel opportunities to NXP assembly sites, OSATs, suppliers, and technology partners