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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in multi-layer PCB design, including high-speed and mixed-signal applications, while ensuring compliance with ISO 9001 and ISO 14001 standards. Capable of collaborating effectively with hardware engineers and guiding junior engineers in layout best practices.
Highest-signal resume keywords
Multi-Layer PCB DesignCadence AllegroImpedance ControlDFM, DFA, DFT RequirementsISO 9001 and ISO 14001 Compliance
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
High-Speed PCB DesignMixed-Signal PCB DesignRF PCB DesignFootprint Library Creation3D STEP Model CreationAnalogue Front-End Circuit RoutingPower Delivery Network OptimisationDifferential Pair RoutingLength MatchingLayout Techniques for Immunity Testing
Soft Skills
Attention to DetailTeam CollaborationIndependent WorkTechnical SupportProject Management
Certifications & Qualifications
HND in Electronic EngineeringHNC in Electronic EngineeringONC in Electronic Engineering
Industry Keywords
Health and Safety GuidelinesIPC StandardsQuality Control WorkflowsDesign ReviewsTechnical Queries Resolution
About the role
Key responsibilities & impact- Produce in-house PCB layouts for New Product Development
- Support the hardware team with layout changes across existing product ranges
- Create high-quality, cost-effective and reliable multi-layer PCB designs from schematic capture through fabrication
- Collaborate with hardware engineers on complex, high-density and mixed-signal printed circuit boards using Cadence Allegro
- Route sensitive analogue front-end circuits while isolating them from noisy high-speed digital buses
- Apply impedance control, length matching and differential pair routing techniques
- Optimise power delivery networks for low-noise performance in test equipment
- Create and maintain footprint libraries and 3D STEP models
- Ensure designs meet DFM, DFA and DFT requirements
- Collaborate with bare-board fabricators and contract manufacturers to resolve technical queries
- Implement layout techniques to help oscilloscopes pass immunity testing
- Guide and review junior engineers
- Establish layout best practices and standard operating procedures
- Ensure Health and Safety, ISO 9001 and ISO 14001 procedures are followed
- Report to the Head of Product Realisation
Requirements
What you’ll need- HND, HNC or higher qualification in Electronic Engineering, or ONC with equivalent practical experience, or equivalent industry experience
- Demonstrable experience in multi-layer, high speed, mixed signal and RF PCB design for New Product Development
- Strong familiarity with ISO 9001 and ISO 14001 procedures and quality control workflows
- Proven ability to participate in design reviews, estimate task timescales and provide technical support across departments
- Excellent attention to detail
- Ability to finish projects to a high quality
- Ability to work independently or as part of a team
- Familiarity with IPC standards, DFM, DFA and DFT requirements
- Experience using Cadence Allegro
- Knowledge of advanced impedance control, length matching, differential pair routing and PDN optimisation
- Knowledge of routing analogue front-end circuits and high-speed digital interfaces
- Experience creating footprint libraries and 3D STEP models
- Ability to adhere to Health and Safety guidelines and ISO procedures
Benefits
Comp & perks- Flexible holidays
- Access to one of three holiday homes
- Annual Profit Related Pay (PRP) bonus
- Electric Vehicle Salary Sacrifice Scheme
- Summer and Christmas parties