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Hardware Thermal Simulation Engineering Intern
Rivian and Volkswagen Group Technologies. Build and run thermal simulations using CFD and conduction models to evaluate cooling performance of vehicle electronic hardware .
Posted 10/9/2026internshipChampaign • Illinois • United StatesEntry Level💰 $35 - $40 per hourWebsite
Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in thermal simulations and analysis, utilizing CFD and conduction models to optimize cooling performance for vehicle electronics. Proficient in collaborating with cross-functional teams and automating analysis processes using scripting and AI tools.
Highest-signal resume keywords
CFD SimulationThermal AnalysisHeat TransferFluid MechanicsScripting Automation
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Thermal SimulationHeat TransferFluid MechanicsThermal Interface MaterialsCooling ConceptsThermal Reliability AssessmentData AnalysisMaterial SelectionLab Measurement TechniquesResearch in Thermal Management
Soft Skills
CollaborationDocumentationPresentation Skills
Tools & Technologies
FlothermAnsys IcepakStar-CCM+FluentAI Tools
Industry Keywords
Electronics CoolingThermal ManagementAutomotive ElectronicsReliability AnalysisFailure Analysis
About the role
Key responsibilities & impact- Build and run thermal simulations using CFD and conduction models to evaluate cooling performance of vehicle electronic hardware
- Support development of electronics cooling and packaging concepts, including heat sinks, thermal interface materials, and enclosure layouts
- Explore design trade-offs that reduce mass, cost, and material usage while meeting thermal targets
- Analyze thermal stack-ups and material choices and summarize findings as recommendations for design engineers
- Support thermal reliability assessments using mission profile data and IC package temperature limits
- Automate repetitive analysis and post-processing tasks using scripting
- Collaborate with mechanical, electrical, and reliability engineers
- Document methods, results, and learnings and present them to the team at the end of the internship
- Work on a real project supporting cooling and packaging of electronics in next-generation vehicles
- Work with an experienced engineer on how thermal simulation informs automotive electronics hardware design decisions
Requirements
What you’ll need- Currently pursuing a Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field
- Coursework or project experience in heat transfer and fluid mechanics
- Familiarity with numerical simulation software
- Ability to use AI tools such as Claude/Gemini to write and debug scripts, automate analysis and post-processing, and verify AI-generated output against engineering fundamentals
- Must be located in Champaign, IL and able to work out of the office in the Research Park
- Hands-on experience with a CFD or thermal simulation tool such as Flotherm, Ansys Icepak, Star-CCM+, Fluent, or similar (preferred)
- Exposure to electronics cooling concepts such as heat sinks, fans, thermal interface materials, or IC package thermal behavior (preferred)
- Experience with lab measurement techniques such as thermocouples, IR imaging, and flow measurement (preferred)
- Interest in reliability, failure analysis, or validation methods (preferred)
- Research, publications, or thesis work in thermal management, heat transfer, or a related area (preferred)
- Availability from January 11, 2027 to August 13, 2027
- Must be authorized to work for an employer in the United States
Benefits
Comp & perks- Competitive base salary
- Equity in the form of Restricted Stock Units (RSUs), subject to board approval and applicable vesting requirements
- Health coverage
- Retirement savings
- Time off
- Family planning programs
- Accessible hiring process and disability accommodations
- Optional interview recording consent; opting out does not impact candidacy