Head of Device Fabrication, Advanced Packaging, and Assembly

Universal Quantum

. Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test .

Posted 9/29/2026full-timeRemote • SingaporeLeadWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in semiconductor process development, advanced packaging, and assembly technologies, with a strong focus on leading multidisciplinary teams and managing strategic relationships in complex environments. Proven ability to translate technical requirements into manufacturable specifications while ensuring compliance with quality and regulatory standards.

Highest-signal resume keywords

Semiconductor Process DevelopmentAdvanced PackagingTeam LeadershipFoundry ManagementMicrofabrication

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

MicrofabricationWafer ProcessingLithographyDepositionEtchWafer BondingDie AttachInterconnectsMetrologyReliability Analysis

Soft Skills

Team DevelopmentStrategic Relationship ManagementCross-Functional Collaboration

Industry Keywords

Semiconductor EngineeringMaterials ScienceMicroelectronicsMechanical EngineeringChemical EngineeringIDMOSATDeep-Tech

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test
Build, lead, and develop a high-performing team of engineers, scientists, technical specialists, and managers across Singapore and Japan
Lead development and optimisation of foundry processes from concept through production
Drive development and industrialisation of advanced packaging, assembly, bonding, and interconnect solutions
Build and manage strategic relationships with foundries, suppliers, and technology partners
Own R&D programmes for foundry, assembly, and packaging technology
Establish qualification and control processes for scalable, reliable manufacturing
Partner with engineering, design, product, and architecture teams to translate requirements into manufacturable specifications
Maintain integrated development plans, budgets, suppliers, risks, and performance measures
Ensure process and package technologies meet quality, reliability, safety, export-control, regulatory, and contractual requirements

Requirements

What you’ll need

Degree (or equivalent experience) in Semiconductor Engineering, Materials Science, Physics, Microelectronics, Mechanical Engineering, Chemical Engineering, or a related technical discipline
Demonstrated success leading and developing multidisciplinary technical teams, including senior engineers, specialists, and managers
Significant experience leading semiconductor process development, advanced packaging, assembly, or device industrialisation within a foundry, IDM, OSAT, deep-tech, or similar environment
Proven track record taking process and technology development from concept through qualification, yield improvement, supplier transfer, and production readiness
Strong technical expertise across microfabrication, wafer processing, lithography, deposition, etch, wafer bonding, die attach, interconnects, packaging, metrology, reliability, or failure analysis
Experience selecting, managing, and developing relationships with foundries, OSATs, suppliers, and external manufacturing partners
Experience working across multiple functions with design, ASIC, systems engineering, product, and architecture teams to deliver manufacturable solutions
Proven ability to lead in complex, multi-site or international environments

Benefits

Comp & perks

Opportunity to shape the future of quantum computing products and organisation
Career growth opportunities
Opportunities to broaden expertise
Meaningful, high-impact engineering challenges
Work alongside world-class scientists and engineers
Inclusive environment where everyone can thrive
Diversity and inclusion commitment
Welcoming team members from all backgrounds