FREE ACCESS
5,000–10,000 jobs/day
See all jobs on Scoutfield
Search thousands of fresh jobs every day.
Discover
- Fresh listings
- Fast filters
- No subscription required
Create a free account and start exploring right away.
Principal Early Supplier Involvement Engineer – AI, Hyperscale Hardware
ZT Systems. Drive hardware co-design, manufacturability, and supply chain readiness for the next-generation Data Center AI Infrastructure platform .
About the role
Key responsibilities & impact- Drive hardware co-design, manufacturability, and supply chain readiness for the next-generation Data Center AI Infrastructure platform
- Act as the technical bridge between System Architects, Mechanical/Thermal/Electrical Engineering teams, and strategic technology suppliers
- Engage suppliers early in the concept phase to de-risk high-density thermal architectures, complex high-speed PCBAs, and high-power delivery systems
- Partner with liquid cooling suppliers to review fluid dynamics, materials compatibility, leak-mitigation designs, and high-volume manufacturability
- Conduct early DFM/DFT reviews with EMS partners and substrate/PCB suppliers for AI accelerator boards and high-speed interconnects
- Collaborate with power supply and busbar manufacturers to optimize high-density power distribution systems for 100kW+ rack architectures
- Work with chassis and rack-fabrication suppliers on structural integrity, tolerance stack-up analysis, and connector alignment
- Oversee prototype builds to accelerate EVT and DVT cycles
- Identify single-point-of-failure components and drive second-source qualification or modular redesigns
- Analyze component geometry, material selection, and process flows to build cost models and maximize production yields
Requirements
What you’ll need- Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or Manufacturing Engineering
- 4–8+ years in NPI engineering, hardware design, supplier technical development, or DFM for high-density compute, networking, or data center hardware
- Hands-on experience with liquid cooling technologies (direct-to-chip, immersion, CDUs) or high-power/high-speed server architecture
- Advanced knowledge of GD&T, CAD software (Creo, SolidWorks, or Siemens NX), and tolerance stack-up analysis for server chasses and rack enclosures
- Direct experience conducting DFM reviews with Tier-1 EMS, PCB fabricators, and custom mechanical/thermal vendors
- Ability to communicate effectively across cross-functional boundaries
- Strong negotiation and technical decision-making skills in high-pressure, fast-paced environments
- Deep understanding of high-frequency materials (e.g., Megtron 6/7/8) and high-density interconnect (HDI) manufacturing
- Familiarity with Telcordia, OCP (Open Compute Project) standards, and NEBS compliance
- Experience with automated should-cost tools (e.g., aPriori) and PLM systems (Agile, Windchill)
- Certain positions may require U.S. citizenship or nationality, lawful permanent residency, refugee/asylee status, or eligibility to obtain an export control license or license exception
Benefits
Comp & perks- Performance-based annual bonus eligibility
- 401(k) retirement savings plan
- Tuition reimbursement for eligible education programs
- Comprehensive medical, dental, and vision coverage with access to leading providers
- Mental health resources and employee wellness support programs
- Company-paid life and disability insurance
- Paid time off (PTO) and company-paid holidays
- Parental leave and family care support programs
- Structured training programs and on-the-job learning opportunities
- Matching gifts and volunteer programs to support causes you care about