Apply

Ready to go for it?

AI Apply speeds things up—apply directly if you prefer.

FREE ACCESS
5,000–10,000 jobs/day
Scoutfield Logo

See all jobs on Scoutfield

Search thousands of fresh jobs every day.

Discover
  • Fresh listings
  • Fast filters
  • No subscription required
Create a free account and start exploring right away.
Cisco

Advanced Packaging & Integration Engineer

Cisco

. Develop advanced packaging technologies for silicon photonic packaging and electronic-photonic integration .

Posted 11/10/2026full-timeSan Jose • California • United StatesMid-LevelSenior💰 $154,900 - $225,300 per yearWebsite

Core Competencies

Role fit
Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in advanced packaging technologies, including silicon photonic integration and hybrid bonding, with a strong focus on project execution and collaboration across multifunctional teams. Proficient in utilizing CAD tools and conducting physical failure analysis to drive innovation in high-density integration.

Highest-signal resume keywords
Advanced Packaging TechnologiesHybrid BondingSilicon Photonic Co-IntegrationCAD Tools (kLayout, APD, Solidworks)Finite Element Analysis

ATS Keywords

Tailor your resume
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills
Advanced Packaging2.5D/3D Chip StackingUltra-Fine Pitch TechnologiesWafer ProcessingFine-Pitch BumpingD2W/W2W Hybrid BondingDesign for ManufacturabilityDesign for ReliabilityPhysical Failure AnalysisNext-Generation Substrate Design
Soft Skills
CollaborationRisk MitigationRoot Cause AnalysisProject ExecutionTeamwork
Certifications & Qualifications
PhD or MS in Mechanical EngineeringElectrical EngineeringPhysics
Industry Keywords
High-Density IntegrationPhotonic IntegrationCPONPOAssembly Processes

Tech Stack

Tools & technologies
Assembly

About the role

Key responsibilities & impact
  • Develop advanced packaging technologies for silicon photonic packaging and electronic-photonic integration
  • Work on 2.5D/3D chip stacking, heterogeneous integration, and ultra-fine pitch interconnect technologies
  • Define, design, and analyze packaging technology test vehicles
  • Validate new technologies against key performance metrics
  • Oversee wafer processing, fine-pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly
  • Collaborate with foundry and assembly partners to develop and qualify packaging solutions for high-density photonics integration, CPO, and on-board optics
  • Guide Design for Manufacturability and Design for Reliability using design and modeling expertise
  • Identify and mitigate risks through advanced root cause analysis and corrective actions
  • Drive packaging technology development from early-stage conceptualization through qualification
  • Engage with OSATs, foundries, and key suppliers to shape technology roadmaps and long-term product platforms

Requirements

What you’ll need
  • PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field
  • 4+ years of progressive industry experience in advanced packaging
  • Proven track record of successful project execution in high-density integration
  • Comprehensive knowledge of advanced interconnect materials, processes, and assembly
  • Knowledge of ultra-fine pitch technologies and hybrid bonding
  • Hands-on experience with CAD tools such as kLayout, APD, and Solidworks
  • Knowledge of physical failure analysis methods
  • Hands-on experience with hybrid bonding and thin die/wafer processing
  • Working knowledge of finite element analysis
  • Deep understanding of next-generation substrate and PCB design and materials
  • Expertise in silicon photonic co-integration (CPO, NPO) is a plus
  • Ability to work effectively within highly multifunctional and geographically distributed technical teams

Benefits

Comp & perks
  • Medical, dental and vision insurance
  • 401(k) plan with a Cisco matching contribution
  • Paid parental leave
  • Short- and long-term disability coverage
  • Basic life insurance
  • Grants of Cisco restricted stock units, subject to eligibility and continued employment
  • 10 paid holidays per full calendar year
  • 1 floating holiday for non-exempt employees
  • 1 paid day off for employee’s birthday
  • Paid year-end holiday shutdown
  • 4 paid days off for personal wellness
  • 16 days of paid vacation time per full calendar year for non-exempt employees
  • Flexible vacation time off program with no defined limit for eligible exempt employees
  • 80 hours of sick time off provided on hire date and each January 1st thereafter
  • Up to 80 hours of unused sick time carried forward
  • Additional paid time away for critical or emergency family issues
  • Optional 10 paid volunteer days per full calendar year
  • Annual bonuses for non-sales roles, subject to Cisco’s policies