Foundry Technology Engineer

Cisco

. Manage the end-to-end PIC and EIC tape-out lifecycle from PDK engagement through DRC sign-off, process integration, and process qualification .

Posted 10/2/2026full-timeUnited StatesMid-LevelSenior💰 $154,900 - $225,300 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Expertise in managing the end-to-end PIC and EIC tape-out lifecycle, with a strong focus on process integration, qualification, and high-volume manufacturing. Proficient in applying design-for-manufacturing principles and leading cross-functional teams in chip development and foundry engagement.

Highest-signal resume keywords

PhD Or MS In Electrical EngineeringChip Development ExperienceProcess Qualification ExpertiseIC Design Tools ProficiencyHigh-Volume Production Success

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Process IntegrationProcess QualificationRoot-Cause AnalysisDesign Of ExperimentsWafer-To-Wafer IntegrationDie-To-Wafer IntegrationHybrid BondingThin-Wafer ProcessingDesign-For-Manufacturing PrinciplesDesign-For-Reliability Frameworks

Soft Skills

Cross-Functional Team LeadershipVendor Relationship ManagementProject Leadership

Tools & Technologies

Cadence VirtuosoSynopsysKlayout

Industry Keywords

PIC FabricationEIC IntegrationSiPh PlatformsCMOS PlatformsNPO ArchitecturesCPO Architectures

About the role

Key responsibilities & impact

Manage the end-to-end PIC and EIC tape-out lifecycle from PDK engagement through DRC sign-off, process integration, and process qualification
Drive bring-up of electronic-photonic integration technology platforms with internal design and external foundry teams
Develop, modify, and optimize photonic and electronic process flows across SiPh and CMOS platforms
Conceptualize and execute critical process modules using design-for-manufacturing principles
Ensure robust process windows and high yield from initial integration through high-volume manufacturing ramp
Lead and optimize wafer-scale EIC-PIC integration using Wafer-to-Wafer and Die-to-Wafer methods
Focus on co-design and co-fabrication strategies
Execute root-cause analysis and Design of Experiments to address failure mechanisms
Apply design-for-reliability frameworks to eliminate failure modes early
Drive process qualification

Requirements

What you’ll need

PhD or MS in Electrical Engineering, Optics, Photonics, or a related field
4+ years of validated experience in chip development, foundry engagement, and process qualification
Demonstrated success in high-volume production environments
Knowledge of DFM, DFR, and DFT principles applied to PIC and EIC fabrication, integration, and characterization
Proficiency in IC design tools including Cadence Virtuoso, Synopsys, and Klayout
Direct experience working with external foundries on process bring-up is highly desired
Hands-on experience with hybrid bonding and thin-wafer processing is preferred
Familiarity or hands-on experience with NPO or CPO architectures is a plus
Ability to work in cross-functional technical teams and lead vendor/foundry relationships
Ability to contribute to and lead projects within matrixed, geographically distributed technical teams

Benefits

Comp & perks

Medical, dental and vision insurance
401(k) plan with a Cisco matching contribution
Paid parental leave
Short- and long-term disability coverage
Basic life insurance
Cisco restricted stock unit grants may be available
10 paid holidays per full calendar year
1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
Paid year-end holiday shutdown
4 paid days off for personal wellness
16 days of paid vacation time per full calendar year for non-exempt employees
Flexible vacation time off program for exempt employees
80 hours of sick time off provided on hire date and each January 1st thereafter
Up to 80 hours of unused sick time carried forward
Additional paid time away for critical or emergency family issues
Optional 10 paid volunteer days per full calendar year
Annual bonuses for non-sales roles, subject to Cisco’s policies
Performance-based incentive pay for sales-plan employees