IC Package Design Engineer

Cisco

. Contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout .

Posted 10/15/2026full-timeCaesarea • IsraelMid-LevelSeniorWebsite

Core Competencies

Role fit

Core Competencies

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Expertise in ASIC Package Design and Board Design, with a strong focus on high-speed signal design, power distribution networks, and advanced packaging technologies. Proven ability to collaborate across teams and drive design improvements in a fast-paced engineering environment.

Highest-signal resume keywords

ASIC Package DesignHigh-Speed Signal DesignPower Distribution NetworksSignal Integrity (SI)Power Integrity (PI)

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Package DesignBoard DesignSilicon Floor PlanningDesign Tradeoff AnalysisAdvanced Packaging TechnologiesHigh-Speed RoutingPinout OptimizationTechnical Problem SolvingTesting and Measurement EquipmentOscilloscope

Soft Skills

CollaborationStakeholder CoordinationDesign Improvement Leadership

Tools & Technologies

EDA ToolsTDR/VNA Analyzers

Industry Keywords

Electrical EngineeringAdvanced Networking Silicon ProductsManufacturable Package Solutions

About the role

Key responsibilities & impact

Contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout
Collaborate across package design, layout, SI/PI, and silicon teams to deliver high-speed, robust, and manufacturable package solutions
Participate in package architecture activities, design tradeoff discussions, and technical problem solving
Develop expertise in advanced packaging technologies and system-level integration
Work on advanced networking silicon products in a collaborative engineering environment

Requirements

What you’ll need

Bachelor’s degree in Electrical Engineering or a related field
3 years of experience as a Package Design / Board Design / HW position
Familiarity with industry-standard EDA tools for layout and design
Strong understanding of high-speed signal design and power distribution networks (PDN)
Experience in ASIC package design, including optimizing pinouts, stack-ups, and high-speed routing
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
Proven track record to drive design improvements and lead stakeholder coordination throughout the design process
Hands-on experience with advanced testing and measurement equipment, including oscilloscopes and TDR/VNA analyzers