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Cisco

Technical Leader, Substrate Component Engineering

Cisco

. Partner with Cisco development engineers, commodity teams, and suppliers to create innovative IC Substrate solutions .

Posted 10/27/2026full-timeTaipei • TaiwanSeniorWebsite

Core Competencies

Role fit
Core Competencies

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Demonstrates extensive expertise in IC Substrate manufacturing, including failure analysis techniques and supplier management, while effectively leading cross-functional teams to resolve complex technical challenges.

Highest-signal resume keywords
IC Substrate Manufacturing ExperienceFailure Analysis TechniquesSupplier Relationship ManagementProblem-Solving SkillsCross-Functional Collaboration

ATS Keywords

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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills
IC SubstrateSLP (Substrate Like PCB)MSAP Process DesignFMEA8D/Corrective ActionFishbone IFDCause and Effect AnalysisDOERisk AssessmentManufacturing Fabrication
Soft Skills
Problem-SolvingConflict ResolutionCustomer FocusDecision-MakingInfluencing
Certifications & Qualifications
MS Degree in EngineeringMS Degree in ChemistryMS Degree in Materials
Industry Keywords
IC Substrate SolutionsTechnical AuditsQuality Control MeasuresSignal IntegrityReliability

About the role

Key responsibilities & impact
  • Partner with Cisco development engineers, commodity teams, and suppliers to create innovative IC Substrate solutions
  • Contribute to the development of IC Substrate commodity strategy
  • Participate in IC Substrate supplier selection; assess and qualify suppliers
  • Take part in technical and process audits of suppliers as needed
  • Lead IC Substrate failure analysis and drive containment, corrective actions, and risk assessment
  • Work with manufacturing and engineering teams to resolve complex technical issues
  • Collaborate with cross-functional teams across the organization
  • Communicate complex technical concepts and solutions effectively

Requirements

What you’ll need
  • MS degree in Engineering, Chemistry, or Materials, or equivalent
  • 15+ years of IC Substrate manufacturing experience
  • Solid understanding and direct experience in IC Substrate and SLP (substrate like PCB), mSAP process design specifications and requirements, qualification, manufacturing fabrication, and test
  • Competency in failure analysis techniques including FMEA, 8D/Corrective Action, Fishbone IFD, Cause and Effect Analysis, DOE, and risk assessment
  • Experience managing supplier relationships and implementing corrective actions and rigorous quality control measures
  • Strong problem-solving and conflict-resolution skills, customer focus, decision-making, influencing, and ability to meet deadlines
  • Familiarity with IC Substrate materials, Signal Integrity, and reliability
  • Ability to lead multiple technical projects and manage day-to-day work while focusing on long-term goals
  • Teamwork and collaboration experience, including leading cross-organizational projects