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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in thermal technology development and validation for electronic systems, with a strong focus on liquid cooling solutions and advanced air-cooling technologies. Proven ability to lead cross-functional teams and engage with suppliers and industry partners to drive innovation and quality in thermal design.
Highest-signal resume keywords
Thermal Technology DevelopmentLiquid Cooling SolutionsComputational Fluid DynamicsThermal ValidationProject Management
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Thermal DesignThermal AnalysisData Acquisition SystemsThermal Interface MaterialsReliability AnalysisMicroelectronics PackagingThermal Conductivity TestingSimulation and TestingManufacturing ProcessesTradeoff Analysis
Soft Skills
Excellent CommunicationProject ManagementLeadership by InfluencePresentation SkillsIndependent Work
Tools & Technologies
Airflow ChambersEnvironmental ChambersVapor ChambersHeat SinksFan Trays2.5D Packaging3D PackagingBGA TechnologyThermal Simulation ToolsExperimental Test Data
Industry Keywords
Thermal PerformanceCooling SystemsMicroelectronics Thermal CoolingJEDEC JESD 51 StandardsODM EngagementIndustry ConsortiaTechnical Case StudiesComponent VendorsSupplier Ecosystem DevelopmentThermal Testing Standards
Tech Stack
Tools & technologiesAirflow
About the role
Key responsibilities & impact- Develop and lead system thermal technology roadmaps with suppliers and internal partners
- Develop quality strategies for liquid cooling manufacturing processes
- Investigate innovative liquid cooling solutions for large-scale hardware systems
- Analyze tradeoffs in thermal performance across package design elements and chip thermal gradients using experimental test data
- Develop test plans and qualification requirements for cooling solutions
- Engage external ODMs and component vendors on design, testing, and production
- Develop and publish technical case studies and papers on cooling-system thermal analysis
- Establish thermal design and testing parameters and correlate design/test results with model predictions
- Contribute to analytical and numerical models using Computational Fluid Dynamics tools
- Drive supplier ecosystem development and participate in industry consortia, conferences, academia, and strategic partnerships
- Integrate circuit thermal simulation and testing with system-level cooling technologies
- Validate and test mechanical designs for electronic assemblies
- Coordinate circuit packaging technologies, including BGA, large-body Flip Chip BGA, 2.5D, and 3D packaging
- Perform component and system reliability analysis
- Collaborate with Business Units, Product Operations, Manufacturing Operations, Planning and Fulfillment, Supplier Management, and suppliers
Requirements
What you’ll need- BS in Mechanical/Thermal or Chemical Engineering
- 10+ years’ experience in design, simulation, and testing of thermal solutions for electronic devices and systems
- Extensive experience with advanced air-cooling technologies, including vapor chambers, remote heat sinks, thermal interface materials, and fans/fan trays
- Experience with liquid cooling and/or immersion cooling
- Experience troubleshooting and performing thermal validation with data acquisition systems, airflow, and environmental chambers
- Familiarity with manufacturing processes for key liquid cooling components
- Ability to lead by influence without a direct reporting chain and advise executive decision makers
- Ability to work independently on multiple projects and priorities
- Excellent communication, project management, and metrics design skills
- Ability to create presentations for diverse audiences and executive levels
- Preferred: MS or PhD in Mechanical or Chemical Engineering or related field
- Preferred: 15+ years of relevant proven experience in microelectronics thermal cooling
- Preferred: Experience with JEDEC JESD 51 thermal testing standards
- Preferred: Experience with Thermal Interface Material Thermal Conductivity Testing procedures and microelectronics packaging design and manufacturing processes
Benefits
Comp & perks- 10 days off each year to give back
- Inclusive Communities supporting diversity, equality, and community involvement
- Opportunities for professional growth and development
- Collaboration with worldwide teams and experts