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EdgeCortix

Senior System-on-Chip Design Engineer

EdgeCortix

. Develop and execute SoC RTL design, integration, and related RTL design checks .

Posted 9/25/2026full-timeRemote • IndiaSeniorWebsite

About the role

Key responsibilities & impact
  • Develop and execute SoC RTL design, integration, and related RTL design checks
  • Participate in and contribute to architecture discussions
  • Work with DFT, Verification, and Physical Design teams
  • Own parts of the SoC design, including one or more subsystems and full-chip-level design activities
  • Plan deliverables in line with overall project deliverables
  • Perform design, frontend, DFT, and verification activities across all stages
  • Handle chip-level clocking, booting, and low-power design
  • Conduct PPA analysis and IP evaluations and selection
  • Collaborate with global teams
  • Partner with design leads and architects and adhere to best practices
  • Contribute to SoC design integration and quality checks
  • Own PPA, design constraints, and Lint/CDC activities as applicable
  • Work with verification, physical design, DFT, and other functions to achieve production-quality silicon
  • Train and mentor fresh engineers
  • Build collaboration with R&D team members and leads across Architecture, SoC, and Implementation
  • Influence technical strategy and drive innovation in products, technology, and/or patents
  • Potentially perform ASIC implementation tasks including synthesis, timing constraints, ECOs, STA, power intent implementation and validation, lint, power analysis, CDC/RDC analysis and validation
  • Potentially perform RTL development and physical design activities from floor-plan definition through place and route
  • Model and analyze performance, area, power, and system cost tradeoffs for different micro-architectures

Requirements

What you’ll need
  • BTech /MTech/ PhD with 10+ years' experience in the semiconductor industry
  • Experienced team lead or technical manager with experience leading a team in SoC Design and Verification
  • Experience in wireless standards and connectivity, including signal processing
  • Experience of SoCs based on ARM Core Architecture, RISC V, Power PC, etc.
  • Understanding of high-speed peripherals like DDR, PCIe, ENET, UCIe
  • Familiarity with interfaces like QSPI, I2C, USB
  • Memory subsystem architecture knowledge
  • Knowledge of Neural Accelerators, CPUs, ARM subsystems, AXI/APB interfaces
  • Strong domain knowledge of clocking, system modes, power management, debug, interconnect, security and other architectures
  • Experience working with Lint, CDC, RDC, Power Aware/Low power design
  • Power management understanding
  • Continuous learning and improvement
  • Pushing the envelope
  • Chiplet implementation and understanding of System In Package
  • Knowledge of latest packaging/substrate technologies
  • Die to Die interfaces knowledge

Benefits

Comp & perks
  • Competitive compensation package
  • Comprehensive paid time off, vacations and sick leaves
  • Opportunity to join a well-funded fabless AI semiconductor startup
  • Opportunity to contribute to the growth and momentum of a company disrupting the AI software and hardware co-design space