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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates extensive expertise in RF/Microwave PCB Design and Layout, with a strong focus on high-speed and high-power applications. Proven ability to mentor junior engineers and collaborate effectively with cross-functional teams to deliver innovative hardware solutions.
Highest-signal resume keywords
15+ Years PCB Layout ExperienceRF/Microwave PCB DesignSiemens Xpedition ToolsetHigh-Speed/High-Density Digital LayoutWire Bond Design
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
PCB LayoutRF/Microwave DesignGrounding TechniquesShielding TechniquesTransmission Line DesignHigh-Power Analog LayoutHigh-Speed Digital LayoutSignal Integrity ToolsPower Integrity ToolsSimulation Tools
Soft Skills
Good Communication SkillsCollaborative MindsetMentorship
Tools & Technologies
Siemens XpeditionAWR Simulation ToolsCST Simulation ToolsHyperLynxHyperLynx DRC
Industry Keywords
RF/MicrowavePCB DesignHigh-Speed DigitalHigh-Power AnalogGroundingShieldingTransmission Lines
About the role
Key responsibilities & impact- Lead the design and delivery of complex RF/microwave and advanced PCB layout projects
- Collaborate with principal and chief engineers in various hardware roles
- Contribute expertise to improve overall project outcomes
- Independently complete RF/microwave and other complex layout projects based on product team inputs and guidance
- Mentor junior engineers in the PCB design process
- Independently evaluate and learn new PCB design tools and technologies
- Accommodate occasional evening meetings for training, mentorship, collaboration, and design reviews
- Collaborate with cross-functional product teams and global engineering teams to deliver high-quality hardware solutions
Requirements
What you’ll need- 15+ years of hands-on experience in PCB layout
- Specialized experience with RF/microwave PCB design, including grounding, shielding, and transmission lines
- Familiarity with high-speed/high-density digital and high-power/high-current analog layout practices
- Good communication skills and a collaborative mindset
- Authorized to work in the United States without sponsorship now and in the future
- Temporary visa holders including E, F-1 (including OPT or CPT), H-1, H-2, L-1, B, J, or TN, or individuals needing sponsorship now or in the future, are not eligible for hire
- Bachelor's degree in any STEM courses (preferred)
- Experience with the Siemens Xpedition toolset (preferred)
- Wire bond design, such as Siemens Xpedition Advanced Packaging tools (preferred)
- RF/microwave simulation tools, such as AWR or CST (preferred)
- Signal or power integrity tools, such as HyperLynx or HyperLynx DRC (preferred)
- Hands-on experience with high-speed/high-density digital and/or high-power/high-current analog layout (preferred)
- Comparative experience with other non-Xpedition platforms (preferred)
Benefits
Comp & perks- Market-leading 401(k) and profit-sharing plan
- Variety of medical insurance plans
- Dental and vision coverage
- Family formation benefits
- Paid parental leave (maternal and paternal)
- Employee Assistance Program
- Tuition reimbursement
- Employee resource groups
- Recognition programs
- Flexible time off plans, including vacation, holiday, and sick leave
- Face-to-face and virtual training
- Mentorship and coaching
- Project management training
- On-the-job training
- Flexible benefit plans supporting physical, mental, financial, and social needs