Director, Design Engineering

GlobalFoundries

. Lead the design and execution of complex SoC, AI/ML, networking, compute, or edge-processing products .

Posted 10/26/2026full-timeAustin • Texas • United StatesLead💰 $191,000 - $332,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates extensive expertise in leading complex SoC and AI/ML product designs, with a strong focus on front-end development, design methodologies, and team leadership. Proven ability to align technical execution with business objectives while fostering collaboration across multiple disciplines.

Highest-signal resume keywords

SoC Design LeadershipFront-End Design ExpertiseEngineering Management ExperienceAdvanced Technology Node ExperienceCustomer-Facing Communication Skills

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

RTL DesignMicroarchitecture DevelopmentSynthesisTiming ClosureDesign VerificationDFT MethodologiesCDC/LintRTL-to-GDSII DevelopmentLow-Power Design MethodologiesChiplet Integration

Soft Skills

Team LeadershipMentoringExecutive CommunicationCollaborationRisk Assessment

Tools & Technologies

EDA ToolsAI FlowsAgile MethodologiesAdvanced Packaging TechnologiesSilicon Learning

Industry Keywords

Semiconductor DesignASIC Tape-OutAI/ML AcceleratorsNetworking ProductsHigh-Performance ComputingFoundry PartnershipsTechnology Roadmap DevelopmentEnvironmental Health Safety & Security

About the role

Key responsibilities & impact

Lead the design and execution of complex SoC, AI/ML, networking, compute, or edge-processing products
Drive front-end development from architecture definition through RTL implementation, integration, synthesis, timing closure, and tape-out readiness
Establish and enforce design methodologies, design quality metrics, and execution frameworks
Use modern AI flows and agile methodologies for fast design development
Guide technical decisions involving performance, power, area, reliability, manufacturability, and product cost
Partner with architecture teams to evaluate product concepts and technology feasibility
Build, mentor, and lead high-performing design teams across multiple disciplines and geographies
Develop organizational capabilities spanning architecture, RTL, integration, verification, DFT, physical design, and silicon bring-up
Drive talent acquisition, succession planning, and leadership development
Collaborate with Architecture, Verification, DFT, Physical Design, Package Design, Software, Product Engineering, Foundry, and Operations teams
Interface with customers, ecosystem partners, IP providers, EDA vendors, and technology partners
Align technical execution with business objectives, schedules, and product roadmaps
Lead reviews, executive communications, risk assessments, and program status reporting
Define and execute design strategies for advanced semiconductor technologies
Partner with foundries and ecosystem partners on technology enablement, PDK readiness, IP qualification, and silicon learning
Drive adoption of advanced design methodologies, low-power architectures, chiplet integration, 2.5D/3D packaging, and emerging AI-driven design flows
Perform all activities in a safe and responsible manner and support Environmental, Health, Safety & Security requirements and programs

Requirements

What you’ll need

Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, or related field
15+ years of semiconductor design experience with progressive technical and leadership responsibility
8+ years of engineering management experience, including leadership of senior technical teams
Proven track record of delivering multiple successful ASIC/SoC tape-outs across advanced technology nodes
Strong hands-on expertise in front-end design, including RTL design and integration, microarchitecture development, synthesis, CDC/Lint, DFT and test methodologies, timing closure, and design verification collaboration
Deep understanding of complete RTL-to-GDSII development flows
Demonstrated experience working on large-scale, complex SoC designs involving multiple IPs, subsystems, and cross-functional teams
Strong customer-facing and executive communication skills
Experience with advanced technology nodes, AI/ML accelerators, compute platforms, networking, automotive, or high-performance computing products, advanced packaging technologies, leading foundries and ecosystem partners, low-power design methodologies, customer engagements, strategic partnerships, and technology roadmap development are preferred