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Hewlett Packard Enterprise

PCB Layout Engineer

Hewlett Packard Enterprise

. Design complex printed circuit board layouts for high-performance computing systems .

Posted 10/15/2026full-timeUnited StatesSeniorLead💰 $95,800 - $220,500 per yearWebsite

About the role

Key responsibilities & impact
  • Design complex printed circuit board layouts for high-performance computing systems
  • Lay out and help release high-speed PCBs into production
  • Apply electrical circuit-performance, signal-integrity, EMI, mechanical form-factor, thermal, and manufacturing requirements
  • Read and interpret schematics, system functionality and performance specifications, and PCB design guidelines
  • Determine PCB design approaches and parameters
  • Influence design decisions related to system-performance issues associated with PCB layout
  • Work with and, when necessary, lead engagements with electrical, mechanical, signal-integrity, and power-integrity engineers and other design partners
  • Coordinate with PCB fabrication shops and PCA contract manufacturers
  • Manage multiple board designs simultaneously

Requirements

What you’ll need
  • Associate degree or equivalent technical degree with 10+ years of experience laying out complex, multilayer, high-speed printed circuit boards
  • Bachelor’s degree in Electrical Engineering or equivalent technical degree with 4+ years of experience laying out complex, multilayer, high-speed printed circuit boards
  • Advanced knowledge of ECAD software, particularly Cadence Allegro PCB Editor
  • Advanced knowledge of PCB design guidelines and design constraints
  • Experience performing layout studies, determining component placement, and helping drive architectural decisions
  • Experience laying out boards with DDR4 or newer, PCIe Gen 4 or newer, high-speed SerDes, Ethernet, I²C, SPI, and similar interfaces
  • Experience with high-speed routing techniques, including microvias, blind and buried vias, and backdrilling
  • Experience working with PCB fabrication shops and PCA contract manufacturers
  • Ability to read and interpret schematics, datasheets, and layout guidelines
  • Working knowledge of electronics, including signal- and power-integrity issues
  • Understanding of EMC principles and EMI mitigation best practices
  • In-depth knowledge of Design for Manufacturing (DFM) and Design for Test (DFT) principles
  • Ability to work independently with loosely defined parameters and perform conceptual analysis
  • Ability to work successfully with engineers across various geographies
  • Ability to manage multiple board designs simultaneously
  • Excellent written and verbal communication skills

Benefits

Comp & perks
  • Comprehensive benefits supporting physical, financial, and emotional wellbeing
  • Personal and professional development programs
  • Flexible work and personal needs management
  • Inclusive workplace
  • Employee benefits information provided through HPE Rewards