Principal Signal Integrity Engineer

Hewlett Packard Enterprise

. Define and drive SI/PI technical strategy, methodologies, design standards, and engineering best practices across storage hardware platforms .

Posted 10/19/2026full-timeUnited StatesLead💰 $147,000 - $279,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Expertise in Signal Integrity and Power Integrity methodologies, with a strong focus on high-speed digital system design and advanced SerDes technologies. Proven ability to lead cross-functional teams, mentor engineers, and drive innovation through technical leadership and collaboration.

Highest-signal resume keywords

Signal Integrity ExpertisePower Integrity ExpertiseHigh-Speed System ArchitectureSerDes TechnologiesTechnical Leadership

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Signal IntegrityPower IntegrityPCB DesignHigh-Speed System ArchitectureElectromagnetic TheorySimulation MethodologiesTransmission Line BehaviorCrosstalkLoss MechanismsJitter

Soft Skills

Excellent CommunicationTechnical LeadershipMentoringInfluencing DecisionsSelf-Directed Leadership

Tools & Technologies

Synopsys HSPICEKeysight ADSAnsys HFSSSIwavePowerSICadence Design EnvironmentsVNAsTDRsHigh-Bandwidth OscilloscopesSpectrum Analyzers

Industry Keywords

Storage Hardware PlatformsHigh-Speed InterfacesDesign StandardsEngineering Best PracticesCross-Functional Technical ReviewsRoot-Cause InvestigationsElectrical Performance OptimizationEmerging TechnologiesInnovationManufacturability

About the role

Key responsibilities & impact

Define and drive SI/PI technical strategy, methodologies, design standards, and engineering best practices across storage hardware platforms
Lead signal and power integrity architecture for next-generation storage systems from concept through production
Provide technical leadership for high-speed interfaces, including next-generation SerDes technologies
Establish SI/PI design guidelines, PCB stackup strategies, routing methodologies, and validation approaches
Lead cross-functional technical reviews and resolve complex SI/PI challenges across products and engineering disciplines
Develop simulation methodologies, modelling approaches, and automation techniques
Evaluate emerging technologies and enable adoption of new architectures and materials
Lead root-cause investigations of field, validation, and manufacturing issues involving SI, PI, timing, and electromagnetic interactions
Partner with PCB, mechanical, thermal, and system architects to optimize electrical performance
Champion innovation through patents, industry engagement, publications, and next-generation technology development
Mentor and develop engineers across multiple sites
Serve as final escalation point for critical SI/PI decisions while balancing performance, risk, schedule, and product cost

Requirements

What you’ll need

Bachelor's, Master's, or PhD degree in Electrical Engineering, Computer Engineering, or related field
15+ years of experience in signal integrity, power integrity, package design, PCB design, and high-speed system architecture
Recognized expertise in high-speed digital system design, electromagnetic theory, transmission line behavior, crosstalk, loss mechanisms, jitter, equalization, and channel optimization
Extensive experience architecting and validating high-speed systems using advanced SerDes technologies and complex storage platforms
Experience leading SI/PI strategies across multiple large-scale product developments from concept through production
Expert knowledge of time-domain, frequency-domain, statistical, BER, and electromagnetic SI/PI simulation methodologies
Expertise with Synopsys HSPICE, Keysight ADS, Ansys HFSS, SIwave, PowerSI, and Cadence design environments
Experience defining PCB stack-ups, design constraints, routing architectures, power distribution networks, and signal integrity requirements for high-volume products
Hands-on expertise with VNAs, TDRs, high-bandwidth oscilloscopes, spectrum analyzers, and compliance test equipment
Ability to correlate simulation results with laboratory measurements and improve modelling accuracy and design predictability
Strong understanding of interactions between signal integrity, power integrity, thermal performance, electromagnetic compatibility, and manufacturability
Demonstrated technical leadership across geographically distributed engineering teams
Ability to influence architecture and engineering decisions without direct authority
Track record of mentoring engineers and developing technical capabilities
Innovation through patents, publications, industry collaboration, or significant technical contributions
Excellent communication and presentation skills
Strong business and engineering judgment
Self-directed leadership in ambiguous environments

Benefits

Comp & perks

Health and wellbeing benefits supporting physical, financial, and emotional wellbeing
Personal and professional development programs
Flexible work and personal-needs management
Hybrid work arrangement
Opportunity to drive patents and industry-leading technical solutions
Inclusive and accessible workplace
Reasonable accommodation during application or interview process