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Hewlett Packard Enterprise

Principal Signal Integrity Engineer

Hewlett Packard Enterprise

. Define and drive SI/PI technical strategy, methodologies, design standards, and engineering best practices across storage hardware platforms .

Posted 10/19/2026full-timeUnited StatesLead💰 $147,000 - $321,000 per yearWebsite

Core Competencies

Role fit
Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in signal integrity and power integrity methodologies, with a strong focus on high-speed system architecture and advanced SerDes technologies. Proven ability to lead cross-functional teams, mentor engineers, and drive technical strategies for next-generation storage systems.

Highest-signal resume keywords
Signal Integrity ExpertisePower Integrity ExpertiseHigh-Speed System ArchitectureAdvanced SerDes TechnologiesTechnical Leadership

ATS Keywords

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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills
Signal Integrity AnalysisPower Integrity AnalysisPCB DesignHigh-Speed Interface DesignElectromagnetic TheorySimulation MethodologiesModeling ApproachesRoot-Cause InvestigationDesign Guidelines DevelopmentValidation Approaches
Soft Skills
MentoringCommunication SkillsPresentation SkillsBusiness JudgmentSelf-Directed Leadership
Tools & Technologies
Synopsys HSPICEKeysight ADSAnsys HFSSSIwavePowerSICadence Design EnvironmentsVNAsTDRsHigh-Bandwidth OscilloscopesSpectrum Analyzers
Industry Keywords
Electromagnetic CompatibilityCrosstalkLoss MechanismsJitterEqualizationChannel OptimizationPower Distribution NetworksManufacturabilityTechnical ContributionsIndustry Collaboration

About the role

Key responsibilities & impact
  • Define and drive SI/PI technical strategy, methodologies, design standards, and engineering best practices across storage hardware platforms
  • Lead signal and power integrity architecture for next-generation storage systems from concept through production
  • Provide technical leadership for high-speed interfaces, including next-generation SerDes technologies
  • Establish SI/PI design guidelines, PCB stackup strategies, routing methodologies, and validation approaches
  • Lead cross-functional technical reviews and resolve complex SI/PI challenges across products and engineering disciplines
  • Develop simulation methodologies, modelling approaches, and automation techniques
  • Evaluate emerging technologies and enable adoption of new architectures and materials
  • Lead root-cause investigations of field, validation, and manufacturing issues involving signal integrity, power integrity, timing, and electromagnetic interactions
  • Partner with PCB, mechanical, thermal, and system architects to optimize end-to-end electrical performance
  • Drive patents, industry engagement, publications, and next-generation technology development
  • Mentor and develop engineers across multiple sites
  • Serve as final escalation point for critical SI/PI technical decisions, balancing performance, risk, schedule, and product cost

Requirements

What you’ll need
  • Bachelor's, Master's, or PhD degree in Electrical Engineering, Computer Engineering, or related field
  • 15+ years of experience in signal integrity, power integrity, package design, PCB design, and high-speed system architecture
  • Deep understanding of electromagnetic theory, transmission line behavior, crosstalk, loss mechanisms, jitter, equalization, and channel optimization
  • Extensive experience architecting and validating high-speed systems using advanced SerDes technologies and complex storage platforms
  • Experience leading SI/PI strategies across multiple large-scale product developments from concept through production
  • Expert knowledge of time-domain, frequency-domain, statistical, BER, and electromagnetic SI/PI analysis
  • Expertise with Synopsys HSPICE, Keysight ADS, Ansys HFSS, SIwave, PowerSI, and Cadence design environments
  • Experience defining PCB stack-ups, design constraints, routing architectures, power distribution networks, and signal integrity requirements for high-volume products
  • Hands-on experience with VNAs, TDRs, high-bandwidth oscilloscopes, spectrum analyzers, and compliance test equipment
  • Ability to correlate simulation results with laboratory measurements
  • Strong understanding of interactions between signal integrity, power integrity, thermal performance, electromagnetic compatibility, and manufacturability
  • Preferred: technical leadership across geographically distributed teams
  • Preferred: influencing architecture and engineering decisions without direct authority
  • Preferred: mentoring engineers and developing technical capabilities
  • Preferred: patents, publications, industry collaboration, or significant technical contributions
  • Preferred: excellent communication and presentation skills
  • Preferred: business and engineering judgment
  • Preferred: self-directed leadership in ambiguous environments

Benefits

Comp & perks
  • Comprehensive health and wellbeing benefits supporting physical, financial, and emotional wellbeing
  • Personal and professional development programs
  • Career growth opportunities
  • Flexible management of work and personal needs
  • Inclusive and accessible workplace
  • Reasonable accommodation during application or interview process
  • Variable incentives may also be offered