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Senior Principal Thermal Engineer
Hewlett Packard Enterprise. Establish organization-wide thermal architectures, design methodologies, specifications, validation practices, and technology roadmaps for liquid-cooled hardware .
Posted 10/15/2026full-timeRoseville • California • United StatesSenior💰 $181,000 - $367,000 per yearWebsite
About the role
Key responsibilities & impact- Establish organization-wide thermal architectures, design methodologies, specifications, validation practices, and technology roadmaps for liquid-cooled hardware
- Serve as the technical leader for direct liquid cooling, cold plates, manifolds, quick disconnects, hoses, piping, pumps, heat exchangers, coolant distribution units, facility-water interfaces, immersion systems, hybrid cooling, and two-phase solutions
- Lead system-level thermal architecture, analysis, and design from concept through qualification, NPI, manufacturing ramp, and sustaining engineering
- Perform and direct thermal-fluid CFD modeling using FloTHERM, FloEFD, Macroflow, or equivalent tools; correlate models with test data
- Define fluid, thermal, mechanical, reliability, serviceability, manufacturability, safety, and regulatory requirements
- Develop and oversee validation plans and empirical testing across component, subsystem, chassis, rack, and facility interfaces
- Review designs and project activities for compliance with technology, quality, reliability, and development standards
- Evaluate and select technologies, suppliers, outsourced development partners, and manufacturing processes
- Partner with mechanical, electrical, PCB, silicon, optics, firmware, systems, reliability, manufacturing, operations, service, sourcing, and data-center infrastructure teams
- Develop schedules, deliverables, resource plans, risk assessments, and support requirements for major programs
- Communicate progress, trade-offs, escalations, and issue analysis to senior and executive stakeholders
- Influence business leaders, customers, partners, suppliers, and industry standards groups
- Drive invention, intellectual property, reusable design practices, knowledge sharing, and engineer mentorship
Requirements
What you’ll need- Bachelor’s or master’s degree in Mechanical Engineering, Thermal Sciences, or a closely related engineering discipline; an advanced degree is preferred
- Typically 15+ years of relevant engineering experience
- Extensive hands-on experience leading electronics thermal design and liquid-cooling development for complex products
- Demonstrated technical impact on significant products, programs, or strategic architecture across multiple NPI cycles
- Deep expertise in single-phase liquid cooling
- Strong knowledge of immersion, dielectric fluids, refrigerant-based or two-phase technologies, and air-liquid hybrid architectures
- Expert understanding of heat transfer, fluid mechanics, thermal resistance, boiling and dry-out limits, flow distribution, pressure drop, pump and heat-exchanger performance, and system controls
- Strong knowledge of cold-plate and manifold design, materials, joining and sealing methods, leak and proof-pressure testing, cleanliness, corrosion, coolant chemistry, reliability, and field service considerations
- Advanced capability with CFD and thermal-network tools
- Proficiency with CAD tools such as SolidWorks or equivalent
- Experience designing for cost, manufacturability, reliability, safety, serviceability, energy efficiency, and sustainability
- Demonstrated business acumen and program leadership, including prioritization, risk management, resource planning, supplier engagement, and negotiation
- Excellent written, verbal, and presentation skills
- Evidence of innovation through patents, publications, standards contributions, or differentiated cooling technologies is highly desirable
Benefits
Comp & perks- Comprehensive health and wellbeing benefits supporting physical, financial, and emotional wellbeing
- Personal and professional development programs
- Flexible work and personal needs management
- Inclusive workplace culture
- Reasonable accommodation during application or interview process for disabilities