Principal ASIC Package Design Engineer

K2 Space Corporation

. Lead advanced ASIC package architecture and execution, focusing on FC-BGA and MCM solutions .

Posted 11/12/2026full-timeRemote • United StatesLead💰 $200,000 - $280,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Expertise in ASIC package architecture and design, with a focus on FC-BGA and MCM solutions, including substrate technologies, signal integrity, and thermal management. Proven ability to lead package strategy from architecture through production, collaborating with cross-functional teams and managing vendor relationships.

Highest-signal resume keywords

ASIC Package DesignFC-BGA ExpertiseSignal Integrity/Power Integrity (SI/PI)Thermal ManagementVendor Management

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

ASIC Package ArchitectureSubstrate Stack-Up DesignHigh-Pin-Count Package DesignPower Delivery Network (PDN) DesignThermal Architecture DesignMaterial SelectionAssembly Process OptimizationPackaging Qualification MethodologiesTrade StudiesMulti-Die Integration

Tools & Technologies

SIWaveHFSSADS

Industry Keywords

Packaging EngineeringMechanical EngineeringElectrical EngineeringOSATExport Control LicenseHigh-Speed InterfacesReliability TestingManufacturabilityQualification TestingDesign Standards

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Lead advanced ASIC package architecture and execution, focusing on FC-BGA and MCM solutions
Own end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp
Serve as the technical authority for package design, defining standards and influencing silicon and system architecture
Own ASIC package architecture including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints
Lead package-level trade studies across cost, performance, power integrity, signal integrity, thermal, manufacturability, and reliability
Define the long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration
Establish organizational package design standards, methodologies, and best practices
Drive detailed FC-BGA package design for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning
Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces
Own package-level SI/PI strategy for high-speed interfaces, PDN design, and decoupling strategy
Lead package-level thermal architecture, including lids, TIMs, heat-spreaders, and system cooling interfaces
Manage external packaging vendors, substrate suppliers, and OSATs, including qualification, capability assessment, contract negotiation, and performance/quality scorecarding
Drive material selection, substrate technology choices, and assembly process optimization

Requirements

What you’ll need

Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
10+ years of experience in ASIC package design, with deep expertise in FC-BGA
Proven experience delivering high-pin-count, high-performance ASIC packages into production
Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs
Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
Experience working directly with OSATs and substrate vendors
Knowledge of packaging qualification and test methodologies
The person hired must either be a “U.S. person” as defined by ITAR or otherwise eligible for a federally issued export control license

Benefits

Comp & perks

Equity in the company
Paid time off
Medical coverage
Dental coverage
Vision coverage
Life insurance
Paid parental leave
Many other perks
Reasonable accommodation for employment applications or interviews