FREE ACCESS
5,000–10,000 jobs/day
See all jobs on Scoutfield
Search thousands of fresh jobs every day.
Discover
- Fresh listings
- Fast filters
- No subscription required
Create a free account and start exploring right away.
Principal ASIC Package Design Engineer
K2 Space Corporation. Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints .
Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Expertise in ASIC package architecture, including FC-BGA design, substrate technologies, and thermal management, with a strong focus on high-performance, high-pin-count solutions. Proven ability to lead package-level trade studies and establish design standards while collaborating with cross-functional teams and external vendors.
Highest-signal resume keywords
ASIC Package DesignFC-BGA ExpertiseSI/PI FundamentalsThermal ManagementVendor Management
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Substrate Stack-Up DesignBall-Map StrategyPower Delivery Network (PDN) DesignSignal Integrity (SI)Power Integrity (PI)High-Speed Digital InterfacesMaterial SelectionAssembly Process OptimizationPackaging Qualification MethodologiesHigh-Speed SerDes
Tools & Technologies
SIWaveHFSSADS
Industry Keywords
Packaging EngineeringMechanical EngineeringElectrical EngineeringMulti-Die IntegrationThermal ArchitectureOSAT CollaborationSubstrate TechnologyContract NegotiationPerformance Quality Score CardingExport Control License Eligibility
Tech Stack
Tools & technologiesAssembly
About the role
Key responsibilities & impact- Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints
- Lead package-level trade studies across cost, performance, power integrity, signal integrity, thermal, manufacturability, and reliability
- Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration
- Establish organizational package design standards, methodologies, and best practices
- Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content
- Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning
- Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces
- Own package-level SI/PI strategy, including high-speed digital interfaces, PDN design, and decoupling strategy
- Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling
- Manage relationships with external packaging vendors, substrate suppliers, and OSATs, including vendor qualification, capability assessment, contract negotiation, and performance/quality score carding
- Drive material selection, substrate technology choices, and assembly process optimization
Requirements
What you’ll need- Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
- 10+ years of experience in ASIC package design, with deep expertise in FC-BGA
- Proven experience delivering high-pin-count, high-performance ASIC packages into production
- Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
- Experience working directly with OSATs and substrate vendors
- Knowledge of packaging qualification and test methodologies
- The person hired must either be a “U.S. person” as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license
Benefits
Comp & perks- 🌐 Worldwide ❌ Jobs You've Hidden ⭐️ Saved Jobs ✅ Applied Jobs ✉️ Email Alerts 👤 Account K2 Space Corporation Website LinkedIn All Job Openings 11 - 50 employees Founded 2022 🎖️ Defense 📦 Logistics 🏭 Manufacturing Defense
- Logistics
- Manufacturing K2 Space Corporation is a California-based aerospace manufacturer that designs and produces large, high-power satellite buses intended to deliver significantly more power, mass and payload volume at lower cost than traditional large satellites. The company emphasizes production-line style builds and commercial supply chains to shorten lead times and reduce per-unit cost, enabling multi-manifest launches and multi-orbit missions across LEO, MEO, GEO and cislunar space. K2 serves commercial, scientific and government/defense customers, and focuses on enabling missions that require high throughput, high-power payloads. Principal ASIC Package Design Engineer 🔥 2 minutes ago 🇺🇸 United States – Remote ⏰ Full Time 🔴 Lead 🧑🔧 Mechanical Engineer 👻 Ghost score 25% Assembly Apply Now Customize resume + cover letter Report problem ☆ Save ☑️ Mark as applied ❌ Hide 📋 Description
- Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints
- Lead package-level trade studies across cost, performance, power integrity, signal integrity, thermal, manufacturability, and reliability
- Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration
- Establish organizational package design standards, methodologies, and best practices
- Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content
- Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning
- Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces
- Own package-level SI/PI strategy, including high-speed digital interfaces, PDN design, and decoupling strategy
- Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling
- Manage relationships with external packaging vendors, substrate suppliers, and OSATs, including vendor qualification, capability assessment, contract negotiation, and performance/quality score carding
- Drive material selection, substrate technology choices, and assembly process optimization 🎯 Requirements
- Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
- 10+ years of experience in ASIC package design, with deep expertise in FC-BGA
- Proven experience delivering high-pin-count, high-performance ASIC packages into production
- Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
- Experience working directly with OSATs and substrate vendors
- Knowledge of packaging qualification and test methodologies
- The person hired must either be a “U.S. person” as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license Apply Now 📊 Check your resume score for this job Improve your chances of getting an interview by checking your resume score before you apply. Check Resume Score Similar Jobs Global Solution Design Engineer 🕒 Yesterday DISHER 51 - 200 🚘 Automotive 💼 Consulting Website LinkedIn All Job Openings Global Solutions Design Engineer designing scalable, commercially sound logistics solutions for customer supply chains. Leading discovery, analytics, proposals, and implementation handoffs across global operations. 🇺🇸 United States – Remote 💵 $120k - $130k / year ⏰ Full Time 🟠 Senior 🔴 Lead 🧑🔧 Mechanical Engineer Staff Mechanical Engineer II 🕒 3 days ago Packaging Corporation of America 10,000+ employees 🏭 Manufacturing 🤝 B2B 🛍️ eCommerce Website LinkedIn All Job Openings Staff Mechanical Engineer improving manufacturing processes, reducing costs, and enhancing production quality for industrial paper and corrugating operations. Leading capital projects, AutoCAD design, contractors, and implementation across the Lower 48 States. 🇺🇸 United States – Remote ⏰ Full Time 🔴 Lead 🧑🔧 Mechanical Engineer Mechanical Engineer 🕒 4 days ago SAIC 10,000+ employees ☁️ SaaS 📣 Marketing 🏢 Enterprise Website LinkedIn All Job Openings Mechanical Engineer serving as ISEA for SAIC’s hypersonic weapons systems. Supporting technical manuals, configuration management, engineering changes, and lifecycle sustainment. 🇺🇸 United States – Remote 🔥 Funding within the last year 💰 $500M Post-IPO Debt - SAIC on 2025-09 ⏰ Full Time 🟠 Senior 🔴 Lead 🧑🔧 Mechanical Engineer Physical Design Engineer 🕒 5 days ago Delos Data 11 - 50 🏭 Manufacturing 💼 Consulting 📦 Logistics Website LinkedIn All Job Openings Principal physical design engineer owning semiconductor block and subsystem implementation. Driving timing, power, physical verification, automation, and tapeout readiness. 🇺🇸 United States – Remote 💵 $180k - $260k / year ⏰ Full Time 🟠 Senior 🔴 Lead 🧑🔧 Mechanical Engineer Node.js Perl Python Principal Security Design Engineer 🕒 5 days ago AECOM 10,000+ employees 💼 Consulting 🏥 Healthcare 📦 Logistics Website LinkedIn All Job Openings Principal Security Design Engineer delivering physical, electronic, and counter-terrorism security design. Supporting AECOM’s global infrastructure and construction projects. 🇺🇸 United States – Remote ⏰ Full Time 🔴 Lead 🧑🔧 Mechanical Engineer 🦅 H1B Visa Sponsor View More Mechanical Engineer Jobs 🌐 Worldwide Built by Lior Neu-ner. I'd love to hear your feedback — Get in touch via DM or support@remoterocketship.com Search Remote jobs Search Jobs by country Search jobs by city Search jobs by job title Search entry-level jobs Search junior-level jobs Search senior-level jobs Search jobs by tech stack Search jobs by contract type Search remote internships Search remote part-time jobs Remote jobs Anywhere in the World Companies Hiring Anywhere in the World Companies Hiring Sales People Anywhere in the World Companies Hiring Software Engineers Anywhere in the World Resources About us Advice Tips for finding remote jobs Interview questions and answers Resume examples Cover letter examples Post a job Affiliates Is Remote Rocketship legit? Privacy policy Terms of service Job board SEO course Remote Job Search MasterClass Resume Review AI Apply Copilot OpenClaw job finder API docs Find jobs using your resume Jobs by Country Remote jobs anywhere in the world (Worldwide remote jobs) Remote jobs United States Remote jobs Australia Remote jobs Brazil Remote jobs Canada Remote jobs France Remote jobs Ireland Remote jobs Germany Remote jobs Netherlands Remote jobs Spain Remote jobs UK Popular Jobs Remote data analyst jobs Remote customer support jobs Remote executive assistant jobs Remote marketing jobs Remote product designer jobs Remote product manager jobs Remote project manager jobs Remote recruiter jobs Remote sales jobs Remote software engineer jobs Jobs by Type Remote full-time jobs Remote part-time jobs Remote contract jobs Remote internship jobs Remote entry-level jobs Remote jobs with no experience required Remote junior jobs (1-3 years of experience) Digital nomad jobs Remote jobs with no degree required Freelance remote jobs Temporary remote jobs Remote jobs hiring now Stay at home mom jobs