Senior ASIC Package Design Engineer

K2 Space Corporation

. Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.

Posted 11/12/2026full-timeRemote • United StatesSenior💰 $180,000 - $260,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Expertise in ASIC package design, particularly in FC-BGA architecture, with a strong focus on substrate technologies, signal integrity, power integrity, and thermal management. Proven ability to lead package-level trade studies and collaborate with cross-functional teams to optimize designs for high-performance, high-pin-count ASICs.

Highest-signal resume keywords

ASIC Package DesignFC-BGA ArchitectureSignal Integrity/Power Integrity (SI/PI)Thermal ManagementSubstrate Technology

ATS Keywords

Tailor your resume

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills

ASIC Package DesignFC-BGAHigh-Pin-Count PackagesSignal IntegrityPower IntegrityThermal ManagementSubstrate TechnologiesMCM IntegrationHigh-Speed Digital InterfacesPackaging Qualification

Tools & Technologies

SIWaveHFSSADS

Certifications & Qualifications

Bachelor’s Degree in Packaging EngineeringBachelor’s Degree in Mechanical EngineeringBachelor’s Degree in Electrical Engineering

Industry Keywords

Aerospace ElectronicsHigh-Reliability ElectronicsOSAT CollaborationHeterogeneous IntegrationAdvanced Laminates

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
Lead package-level trade studies across cost, performance, power integrity, signal integrity, thermal, manufacturability, and reliability.
Establish package design standards, methodologies, and best practices.
Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network design, and decoupling strategy.
Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
Manage relationships with external packaging vendors, substrate suppliers, and OSATs.
Drive material selection, substrate technology choices, and assembly process optimization.
Support end-to-end package strategy from early architecture and trade studies through vendor engagement, qualification, and production ramp.
Define standards, influence silicon and system architecture, and ensure first-pass success for complex, high-speed, power-dense ASICs.

Requirements

What you’ll need

Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
Proven experience delivering high-pin-count, high-performance ASIC packages into production.
Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
Experience working directly with OSATs and substrate vendors.
Knowledge of packaging qualification and test methodologies.
U.S. person status as defined by ITAR or eligibility for a federally issued export control license.
Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates) is nice to have.
Background in high-speed digital or mixed-signal SoCs is nice to have.
Familiarity with aerospace, space, or high-reliability electronics is nice to have.

Benefits

Comp & perks

Equity in the company
Comprehensive benefits package
Paid time off
Medical coverage
Dental coverage
Vision coverage
Life insurance
Paid parental leave
Many other perks