Senior ASIC Package Design Engineer

K2 Space Corporation

. Implement advanced ASIC package architecture with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions .

Posted 9/15/2026full-timeRemote • United StatesSeniorWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Expertise in ASIC package design with a focus on FC-BGA and MCM solutions, including substrate stack-up, signal integrity, and thermal management. Proven ability to lead package-level trade studies and manage vendor relationships to optimize high-performance mixed-signal and digital SoCs.

Highest-signal resume keywords

ASIC Package DesignFC-BGA ExpertiseSignal Integrity FundamentalsThermal ManagementVendor Engagement

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

ASIC Package ArchitectureSubstrate Stack-Up DesignHigh-Pin-Count Package DesignPower Delivery Network DesignDecoupling StrategyMechanical Interface DesignTrade StudiesMaterial SelectionAssembly Process OptimizationPackaging Qualification Methodologies

Tools & Technologies

SIWaveHFSSADS

Certifications & Qualifications

Bachelor’s Degree in Packaging EngineeringBachelor’s Degree in Mechanical EngineeringBachelor’s Degree in Electrical Engineering

Industry Keywords

Mixed-Signal SoCsHigh-Speed DigitalHeterogeneous IntegrationAerospace ElectronicsHigh-Reliability Electronics

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Implement advanced ASIC package architecture with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions
Support end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp
Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints
Lead package-level trade studies across cost, performance, power integrity, signal integrity, thermal, manufacturability, and reliability
Establish package design standards, methodologies, and best practices
Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning
Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces
Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network design, and decoupling strategy
Lead package-level thermal architecture, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling
Manage relationships with external packaging vendors, substrate suppliers, and OSATs
Drive material selection, substrate technology choices, and assembly process optimization

Requirements

What you’ll need

Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
5+ years of experience in ASIC package design, with deep expertise in FC-BGA
Proven experience delivering high-pin-count, high-performance ASIC packages into production
Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs
Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
Experience working directly with OSATs and substrate vendors
Knowledge of packaging qualification and test methodologies
The person hired must either be a “U.S. person” as defined by ITAR or otherwise eligible for a federally issued export control license
Nice to Have: Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates)
Nice to Have: Background in high-speed digital or mixed-signal SoCs
Nice to Have: Familiarity with aerospace, space, or high-reliability electronics

Benefits

Comp & perks

Reasonable accommodation available as part of the employment application or interview process
Equal Opportunity Employer