Advanced Packaging Design – SI/PI Engineer

Marvell Technology

. Perform SI/PI analysis of designs and optimization within 2D/2.5D/3D packages .

Posted 10/21/2026full-timeUnited StatesMid-LevelSenior💰 $134,400 - $198,910 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in signal and power integrity analysis, circuit extraction, and simulation within semiconductor packaging design. Proficient in utilizing EDA tools for optimization and verification of package and PCB designs while collaborating effectively with cross-functional engineering teams.

Highest-signal resume keywords

Signal Integrity VerificationPower Integrity Design OptimizationElectrical Engineering ConceptsEDA Simulation ToolsSemiconductor Packaging Design

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Signal IntegrityPower IntegrityCircuit ExtractionSimulationDesign OptimizationElectrical Requirements EvaluationWiring StudiesFloor-PlanningPackage DesignPCB Design

Soft Skills

Strong Communication SkillsPresentation SkillsDocumentation Skills

Tools & Technologies

PowerSISIwaveAnsys HFSSKeysight ADSCadence Sigrity

Industry Keywords

Semiconductor PackagingInterposer DesignPackaging TechnologiesPackage Substrate Design RulesAssembly Rules

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Perform SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
Interface with product design teams for optimized floor-planning, package-related design input and power delivery network design
Perform wiring studies to determine optimal signal routing, power delivery verification and package size determination
Evaluate package or PCB designs for challenging electrical requirements
Interact closely with physical designers and IP teams to optimize electrical performance
Execute simulation tasks for signal and power integrity sign-off
Work with engineers in multiple locations and geographies

Requirements

What you’ll need

Interest in semiconductor packaging design
Experience with signal and power integrity verification and design optimization
Deep knowledge of Electrical Engineering concepts, circuit extractions and simulation
Familiarity with design methodology and strategies
BS degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or MS degree and 1+ year, or PHD completion
Understanding of signal integrity and power integrity concepts and fundamentals
Experience with simulation and analysis using tools like PowerSI, SIwave
Working knowledge of circuit extractions and simulations
Ability to work with engineers in multiple locations and geographies
Strong communication, presentation and documentation skills
Experience in package development, including interposer design
Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Eligibility to access export-controlled information under applicable U.S. law

Benefits

Comp & perks

Bonus and equity plans
New hire equity grant
Annual equity refreshers
Employee stock purchase plan with a 2-year look back
Family support programs
Mental health resources
Recognition and service awards