Senior Staff Engineer, Signal Integrity and Power Integrity

Marvell Technology

. Contribute to development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond .

Posted 10/19/2026full-timeWestlake Village • California • United StatesSenior💰 $142,700 - $211,230 per yearWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in advanced microelectronic package development, including electrical design, modeling, and characterization for high-speed signaling. Proficient in managing cross-functional teams and utilizing simulation tools for package design and analysis.

Highest-signal resume keywords

Microelectronic Package DevelopmentEM Simulation ToolsPackage Layout ToolsHigh-Speed Electronic PackagingCross-Functional Team Management

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Electrical DesignModeling and CharacterizationSignal IntegrityPower Integrity2.5D/3D Package DevelopmentPower-Plane DesignEM TheoryTransmission LinesHigh-Speed SignalingThermal Analysis

Soft Skills

Communication SkillsPresentation SkillsDocumentation Skills

Tools & Technologies

Ansys HFSSSI-WaveCadence ClarityAPDPADSPythonSpectreADSHSpiceMATLAB

Industry Keywords

MicroelectronicsIC Package LayoutPackaging TechnologiesEMI/EMCExport-Controlled Information

Tech Stack

Tools & technologies

AssemblyPython

About the role

Key responsibilities & impact

Contribute to development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond
Lead package development, electrical design, modeling and characterization, including signal and power integrity
Consider manufacturing and assembly tolerances
Interface with package suppliers to select package technology
Drive package layout and ensure manufacturability and compliance with performance, reliability and cost requirements
Interface with marketing and IC designers to develop achievable package specifications
Contribute to new package technology development
Collaborate with assembly development, IC physical layout, analog and digital design, and marketing teams
Support new product introduction from concept through development and production

Requirements

What you’ll need

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5–8 years of related professional experience, or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1–3 years of experience
Strong fundamentals in EM, transmission lines and microwave theory
Experience using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, and Cadence Clarity
Ability to manage package development involving cross-functional teams
Familiarity with IC package layout tools such as APD or PADS
Experience with 2.5D/3D package development highly desired
Ability to automate SI, PI and packaging activities using Python or similar scripting tools
Working knowledge of Spectre, ADS, and HSpice
Experience with VNA and TDR measurements for package and PCB characterization
Frequency-domain and time-domain knowledge of high-speed signaling
Experience with high-speed electronic packaging for digital and analog ICs
Power-plane design, modeling and analysis using PowerSI or SIwave
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Understanding, debugging and simulation of EMI/EMC problems
Knowledge of thermal and mechanical analysis of IC package development is a plus
Experience with channel simulations using MATLAB, ADS or other tools is a plus
Strong communication, presentation and documentation skills
Must be eligible to access export-controlled information under applicable U.S. law; some applicants may be subject to an export license review process

Benefits

Comp & perks

Bonus and equity plans
New hire equity grant
Annual equity refreshers
Employee stock purchase plan with a 2-year look back
Family support programs
Mental health resources
Recognition and service awards