Senior/Staff Advanced Packaging Materials Engineer

The College of Education at The University of Texas at Austin

. Develop new formulations and evaluate current materials used in advanced packaging products .

Posted 11/5/2026full-timeAustin • Texas • United StatesSeniorWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in advanced semiconductor packaging materials development, including polymer chemistry and materials characterization techniques. Capable of leading experiments, optimizing processes, and collaborating effectively with cross-functional teams.

Highest-signal resume keywords

Semiconductor Packaging Industry ExperiencePolymer Chemistry KnowledgeMaterials Characterization TechniquesDesign of Experiments (DOE) MethodologiesAdvanced Semiconductor Packaging Technologies

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Materials DevelopmentProcess IntegrationMaterial CharacterizationThermal Properties AnalysisMechanical Properties TestingRoot-Cause InvestigationExperiment DesignData AnalysisReliability TestingAdhesion Mechanisms

Soft Skills

Effective CommunicationMentoringCollaboration

Tools & Technologies

DSCTGADMAFTIRTMA

Industry Keywords

2.5D Integration3D IntegrationHeterogeneous IntegrationChipletsWafer-Level PackagingHybrid BondingTemporary Bonding and Debonding (TBDB)

About the role

Key responsibilities & impact

Develop new formulations and evaluate current materials used in advanced packaging products
Work with process development, internal teams, and external vendors to define and create material candidates and material-based solutions
Develop comprehensive testing and characterization plans for internally developed and externally acquired materials
Drive material formulation, characterization, and process optimization through structured Design of Experiments (DOE), data analysis, and root-cause investigations
Design and execute experiments evaluating material properties, process performance, reliability, and compatibility with 2.5D/3D integration, heterogeneous and mixed material integration, and hybrid bonding
Lead material qualification and performance validation for innovative advanced semiconductor packaging materials
Collaborate with process engineering, equipment development, manufacturing, and external partners to integrate new materials into semiconductor packaging processes
Serve as technical subject matter expert with customers, suppliers, and industry partners
Translate technical requirements into material specifications, development roadmaps, and commercially viable solutions
Mentor junior engineers and students
Communicate effectively and perform other duties as assigned

Requirements

What you’ll need

Senior Engineer: Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline and two years of experience in semiconductor packaging industry or a closely related industry, or Master’s degree or higher in the same fields
Staff Engineer: Bachelor’s degree in the stated fields and five years of relevant experience, or Master’s degree or higher and three years of relevant experience, or Ph.D. in the stated fields
Experience in semiconductor packaging industry or a closely related industry
Prior hands-on experience in semiconductor packaging materials development, process integration, or related manufacturing technologies
Strong understanding of advanced semiconductor packaging architectures and technologies, including 2.5D/3D integration, heterogeneous integration, chiplets, wafer-level packaging, and hybrid bonding
In-depth knowledge of polymer chemistry, structure-property relationships, adhesion mechanisms, interfacial science, thermal and mechanical properties, and material reliability
Proficiency in materials characterization and analytical techniques such as DSC, TGA, DMA, FTIR, TMA, and mechanical testing
Ability to independently design and execute experiments, apply Design of Experiments (DOE) methodologies, troubleshoot complex technical challenges, and translate research findings into practical engineering solutions
Relevant education and experience may be substituted as appropriate
Preferred: Ph.D. in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline
Preferred: 3 or more years of experience in semiconductor packaging industry or a closely related industry
Preferred: Two or more years of experience working on Temporary Bonding and Debonding (TBDB) materials and processes
Experience in a startup or research and development (R&D) environment
Resume/CV
3 work references with contact information, including at least one supervisor reference
Criminal history background check required for finalists
Required to present acceptable original documents proving identity and authorization to work in the United States by the third day of employment

Benefits

Comp & perks

Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
Optional Retirement Program (ORP) instead of TRS, subject to eligibility
Occasional work outside standard office hours during peak periods and special events